SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 5, 2009, Pages 663-669

Lead-free bumping using an alternating electromagnetic field

(5) Xu, Hongbo a Li, Mingyu a Chen, Hongtao a,c Fu, Yonggao b Wang, Ling b

a HARBIN INSTITUTE OF TECHNOLOGY (China)

b China National Electric Apparatus Research Institute (China)

c JIAMUSI UNIVERSITY (China)

Author keywords

Alternating electromagnetic field (AEF); IMC; Lead free; Localized heating; Low temperature bumping; Reflow

Indexed keywords

ALTERNATING ELECTROMAGNETIC FIELD (AEF); IMC; LEAD-FREE; LOCALIZED HEATING; LOW-TEMPERATURE BUMPING; REFLOW;

BRAZING; ELECTROMAGNETIC FIELD MEASUREMENT; ELECTROMAGNETIC FIELDS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEATING; LEAD COMPOUNDS; MELTING POINT; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN; WELDING;

LEAD;

EID: 62549166622 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0722-6 Document Type: Article

Times cited : (3)

References (20)

1
- 62549085282
- US Patents, no. 4,696,104
- R. Vanzetti and A.S. Dostoomian, US Patents, no. 4,696,104 (1987).
- (1987)
- Vanzetti, R.¹ Dostoomian, A.S.²

2
- 0036723548
- 10.1016/S0921-5107(02)00270-2
- Y.H. Tian C.Q. Wang X.S. Ge P. Liu D.M. Liu 2002 Mater. Sci. Eng. B 95 254 10.1016/S0921-5107(02)00270-2
- (2002) Mater. Sci. Eng. B , vol.95 , pp. 254
- Tian, Y.H.¹ Wang, C.Q.² Ge, X.S.³ Liu, P.⁴ Liu, D.M.⁵

3
- 1642317993
- 10.1088/0965-0393/12/2/005
- Y.H. Tian C.Q. Wang D.M. Liu 2004 Model. Simul. Mater. Sci. Eng. 12 235 10.1088/0965-0393/12/2/005
- (2004) Model. Simul. Mater. Sci. Eng. , vol.12 , pp. 235
- Tian, Y.H.¹ Wang, C.Q.² Liu, D.M.³

4
- 0002944196
- D.J. Hayes, D.B. Wallace, and M.T. Boldman, Proc. ISHM (1992), p. 316.
- (1992) Proc. ISHM , pp. 316
- Hayes, D.J.¹ Wallace, D.B.² Boldman, M.T.³

5
- 0036452410
- T. Oppert, L. Titerle, E. Zakel, G. Azdasht, and T. Teutsch, Proceedings of International Symposium on Microelectronics (2002), p. 145.
- (2002) Proceedings of International Symposium on Microelectronics , pp. 145
- Oppert, T.¹ Titerle, L.² Zakel, E.³ Azdasht, G.⁴ Teutsch, T.⁵

6
- 14244250419
- 10.1088/0960-1317/15/2/020
- H. Yang M. Wu W. Fang 2005 J. Micromech. Microeng. 15 394 10.1088/0960-1317/15/2/020
- (2005) J. Micromech. Microeng. , vol.15 , pp. 394
- Yang, H.¹ Wu, M.² Fang, W.³

7
- 33947285665
- M. Li H. Xu J. Kim H. Kim 2007 J. Mater. Sci. Technol. 23 61
- (2007) J. Mater. Sci. Technol. , vol.23 , pp. 61
- Li, M.¹ Xu, H.² Kim, J.³ Kim, H.⁴

8
- 44449086514
- 10.1109/TADVP.2008.923385
- M. Li H. Xu S.W.R. Lee J. Kim D. Kim 2008 IEEE Trans. Adv. Packag. 31 399 10.1109/TADVP.2008.923385
- (2008) IEEE Trans. Adv. Packag. , vol.31 , pp. 399
- Li, M.¹ Xu, H.² Lee, S.W.R.³ Kim, J.⁴ Kim, D.⁵

9
- 0033747819
- 10.1016/S0927-796X(00)00010-3
- M. Abtew G. Selvaduray 2000 Mater. Sci. Eng. 27 95 10.1016/S0927-796X(00) 00010-3
- (2000) Mater. Sci. Eng. , vol.27 , pp. 95
- Abtew, M.¹ Selvaduray, G.²

10
- 33845684212
- 10.1007/s10854-006-9010-x
- S.W. Chen C.H. Wang S.K. Lin C.N. Chiu 2007 J. Mater. Sci.: Mater. Electron. 18 19 10.1007/s10854-006-9010-x
- (2007) J. Mater. Sci.: Mater. Electron. , vol.18 , pp. 19
- Chen, S.W.¹ Wang, C.H.² Lin, S.K.³ Chiu, C.N.⁴

11
- 51249164034
- 10.1007/BF02651361
- J. Glazer 1994 J. Electron. Mater. 23 693 10.1007/BF02651361
- (1994) J. Electron. Mater. , vol.23 , pp. 693
- Glazer, J.¹

12
- 51249170304
- 10.1007/BF02651374
- F. Bartels J.W. Morris Jr. 1994 J. Electron. Mater. 23 787 10.1007/BF02651374
- (1994) J. Electron. Mater. , vol.23 , pp. 787
- Bartels, F.¹ Morris Jr., J.W.²

13
- 39149126674
- 10.1016/j.actamat.2007.11.009
- J.O. Suh K.N. Tu G.V. Lutsenko A.M. Gusak 2008 Acta Mater. 56 1075 10.1016/j.actamat.2007.11.009
- (2008) Acta Mater. , vol.56 , pp. 1075
- Suh, J.O.¹ Tu, K.N.² Lutsenko, G.V.³ Gusak, A.M.⁴

14
- 0000072496
- 10.1103/PhysRevB.53.16027
- H.K. Kim K.N. Tu 1996 Phys. Rev. B 53 16027 10.1103/PhysRevB.53.16027
- (1996) Phys. Rev. B , vol.53 , pp. 16027
- Kim, H.K.¹ Tu, K.N.²

15
- 23244444658
- 10.1007/s11664-005-0099-0
- K. Moon Y. Li J. Xu C.P. Wong 2005 J. Electron. Mater. 34 1081 10.1007/s11664-005-0099-0
- (2005) J. Electron. Mater. , vol.34 , pp. 1081
- Moon, K.¹ Li, Y.² Xu, J.³ Wong, C.P.⁴

16
- 33846482155
- 10.1007/s11837-007-0008-5
- S. Chen C. Wang S. Lin C. Chiu C. Chen 2007 JOM 59 39 10.1007/s11837-007-0008-5
- (2007) JOM , vol.59 , pp. 39
- Chen, S.¹ Wang, C.² Lin, S.³ Chiu, C.⁴ Chen, C.⁵

17
- 0000757389
- 10.1063/1.1321787
- J.W. Jang D.R. Frear T.Y. Lee K.N. Tu 2000 J. Appl. Phys. 88 6359 10.1063/1.1321787
- (2000) J. Appl. Phys. , vol.88 , pp. 6359
- Jang, J.W.¹ Frear, D.R.² Lee, T.Y.³ Tu, K.N.⁴

18
- 0142165074
- 10.1109/TCAPT.2003.817860
- G.Y. Li B.L. Chen 2003 IEEE Trans. Comp. Packag. Technol. 26 651 10.1109/TCAPT.2003.817860
- (2003) IEEE Trans. Comp. Packag. Technol. , vol.26 , pp. 651
- Li, G.Y.¹ Chen, B.L.²

19
- 43949087261
- NIST Washington
- W. J. Boettinger, U. R. Kattner, K. W. Moon, J. H. Perepezko (2006) DTA and Heat-Flux DSC Measurements of Alloy Melting and Freezing. Washington:NIST
- (2006) DTA and Heat-Flux DSC Measurements of Alloy Melting and Freezing
- Boettinger, W.J.¹ Kattner, U.R.² Moon, K.W.³ Perepezko, J.H.⁴

20
- 51249164221
- 10.1007/BF02651371
- W. Yang R.W. Messler Jr. L.E. Felton 1994 J. Electron. Mater. 23 765 10.1007/BF02651371
- (1994) J. Electron. Mater. , vol.23 , pp. 765
- Yang, W.¹ Messler Jr., R.W.² Felton, L.E.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.