Optimization of reflow-thernial profile by design of experiments with response surface methodology for minimizing solder-ball defects

Proceedings of the 4th IEEE International Conference on Management of Innovation and Technology, ICMIT

Volumn , Issue , 2008, Pages 412-417

  Chansa ngavej, Chuvej ^a   Kasemsomporn, Jumroon ^a  

^a SHINAWATRA UNIVERSITY   (Thailand)

Author keywords

Process optimization; Reflow thermal profile; Response surface methodology; Solder ball defects

Indexed keywords

BRAZING; DEFECTS; DESIGN OF EXPERIMENTS; ELECTRIC FAULT LOCATION; EXPERIMENTS; FLIP CHIP DEVICES; INNOVATION; OPTIMIZATION; PROJECT MANAGEMENT; SOLDERING ALLOYS; SPHERES; SURFACE DEFECTS; SURFACE PROPERTIES; WELDING;

COMPLEX PROCESSES; COST SAVINGS; DESIGNED EXPERIMENTS; ERROR METHODS; EXPERIMENTAL DATUMS; HEAT TIMES; INPUT VARIABLES; LESSONS LEARNED; OPTIMAL CONDITIONS; OPTIMAL RESPONSES; OUTPUT VARIABLES; PROCESS OPTIMIZATION; QUALITY RISKS; REFLOW-SOLDERING; REFLOW-THERMAL PROFILE; RESEARCH PROJECTS; RESPONSE SURFACE METHODOLOGIES; RESPONSE SURFACE METHODOLOGY; SHORT CIRCUITS; SOLDER BALLS; THERMAL PROFILES;

SOLDERING;

EID: 56749166060     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMIT.2008.4654400     Document Type: Conference Paper

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