Microstructure, defects, and reliability of mixed Pb-Free/Sn-Pb assemblies

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 292-302

  Snugovsky, Polina ^a   McCormick, Heather ^a   Bagheri, Simin ^a   Bagheri, Zohreh ^a   Hamilton, Craig ^a   Romansky, Marianne ^a  

^a Celestica   (Canada)

Author keywords

Backward compatibility; Microstructure; Pb free components Sn Pb solder mixed assembly; Reliability

Indexed keywords

ACCELERATED THERMAL CYCLING; BACKWARD COMPATIBILITY; BALL GRIDS; CELESTICA; EUTECTIC SOLDERS; INTERCONNECT DEFECTS; LESSONS LEARNT; NON UNIFORMS; PB-FREE COMPONENTS/SN-PB SOLDER MIXED ASSEMBLY; PEAK TEMPERATURES; PHASE DISTRIBUTIONS; TEST VEHICLES; VOID FORMATIONS; WEIBULL PLOTS;

AUTOMOBILE PARTS AND EQUIPMENT; BALL GRID ARRAYS; BRAZING; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; LEAD ALLOYS; MICROSTRUCTURE; RELIABILITY; TIN; WELDING;

LEAD;

EID: 58349107235     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0592-3     Document Type: Article

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