Analysis of dynamic behavior of solder reflow by solder ball test

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

Volumn , Issue , 2004, Pages 92-95

  An, Bing ^a   Zheng, Zonglin ^a   Wu, Fengshun ^a   Lu, Jun ^a   Zhang, Xiaodong ^b   Wu, Yiping ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Shenzhen Cleanseal Co Ltd   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; CHARGE COUPLED DEVICES; DRYING; EVALUATION; HOT AIR HEATING; PRINTED CIRCUIT BOARDS; SHRINKAGE; STANDARDS; SURFACE MOUNT TECHNOLOGY;

REFLOW DEFECTS; SOLDER BALL TEST; SOLDER PASTES; SOLDER REFLOW;

SOLDERING;

EID: 4544255165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Lee, N. C., Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies, Boston, Newnes, (2001), pp. 37-55, 107-142.
2. Zhou, R. S., Wu, L., SMT Technical Materials, SMT committee of Shichuan Electric Academy, (1999), pp. 84-114
3. IPC-TM-650 2.4.43 Solder Ball Testing, TEST METHODS MANUAL, Northbrook, IL 60062-6135, pp. 1-3.
4. Lee, N. C., "Optimizing the reflow profile via defect mechanism analysis," Soldering & Surface Mount Technology, Vol. 11 (1999), pp. 13-20