Reflow profile study of the Sn-Ag-Cu solder

Soldering and Surface Mount Technology

Volumn 16, Issue 1, 2004, Pages

  Salam, B ^a   Virseda, C ^b   Da, H ^a   Ekere, N N ^a   Durairaj, R ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b European Fuel Cell ^*

Author keywords

Soldering; Surface texture; Surface treatment

Indexed keywords

COOLING; DISSOLUTION; GRAIN BOUNDARIES; INTERMETALLICS; MICROSTRUCTURE; SOLDERING; SURFACE TREATMENT; THERMAL EFFECTS;

RAMP-SOAK-SPIKE (RSS) REFLOW; RAMP-TO-SPIKE (RTS) REFLOW; SURFACE TEXTURE;

TIN ALLOYS;

EID: 1642407142     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910410517022     Document Type: Article

References (11)

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