The analysis of creep data for solder alloys

Soldering and Surface Mount Technology

Volumn 15, Issue 1, 2003, Pages 26-30

  Plumbridge, W J ^a  

^a NONE

Author keywords

Lead free; Reliability; Solder

Indexed keywords

CREEP; DEFORMATION; EXTRAPOLATION; FAILURE ANALYSIS; LEAD; STRESS ANALYSIS;

CREEP RATE; LEAD FREE ALLOYS; LIFE ESTIMATION; STRESS RUPTURE;

SOLDERING ALLOYS;

EID: 0037216975     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310455699     Document Type: Article

References (5)

1. Kariya, Y. and Plumbridge, W.J. (2001), "Mechanical properties of Sn-3.0Ag-0.5Cu alloy", Seventh Symposium on Microjoining and Assembly Technology in Electronics, MATE 2001, February 2001, Yokohama.
2. Monkman, F.C. and Grant, N.J. (1956), "An empirical relationship between rupture life and minimum creep rate in creep rupture tests", Proc. Am. Soc. for Testing and Materials, Vol. 56, pp. 593-620.
3. Plumbridge, W.J. and Gagg, C.R. (1999), "Effects of strain rate and temperature on the stress-strain response of solder alloys", J. Electron. Mater., Vol. 10, pp. 461-8.
4. Plumbridge, W.J. and Gagg, C.R. (2000), "The mechanical properties of lead-containing and lead-free solders - meeting the environmental challenge", Proc. Inst. Mech. Engrs - J. Materials Design and Application, Vol. 214, pp. 153-61.
5. Plumbridge, W.J., Gagg, C.R. and Peters, S. (2001), "Creep of lead-free solders at 75°C", J. Electron. Mater., Vol. 30, pp. 1178-83.