Effect of additives on shape evolution during electrodeposition: III. Trench infill for on-chip interconnects

Journal of the Electrochemical Society

Volumn 155, Issue 3, 2008, Pages

  Qin, Yan ^a,c   Li, Xiaohai ^a,c   Xue, Feng ^a   Vereecken, Philippe M ^a,c,d   Andricacos, Panayotis ^b   Deligianni, Hariklia ^b,c   Braatz, Richard D ^a,c   Alkire, Richard C ^a,c  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c ELECTROCHEMICAL SOCIETY

^d IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRODEPOSITION; NUMERICAL METHODS; POLYETHYLENE GLYCOLS;

ON-CHIP INTERCONNECTS; RECTANGULAR TRENCHES;

COPPER;

EID: 38349178839     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2816282     Document Type: Article

References (22)

1. P. C. Andricacos, C. Uzoh, J. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev., 42, 567 (1998).
2. X. Li, T. O. Drews, E. Rusli, F. Xue, Y. He, R. D. Braatz, and R. C. Alkire, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2434686, 154, D230 (2007).
3. E. Rusli, F. Xue, T. O. Drews, P. Vereecken, P. Andracacos, H. Deligianni, R. D. Braatz, and R. C. Alkire, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2772425, 154, D584 (2007).
4. T. P. Moffat, in Advances in Electrochemical Science and Engineering, R. Alkire, D. Kolb, J. Lipkowski, and, P. Ross, Editors, Vol. 10, VCH-Wiley Publishers, Weinheim (2007).
5. P. M. Vereecken, R. A. Binstead, H. Deligianni, and P. C. Andricacos, IBM J. Res. Dev., 49, 3 (2005).
6. J. G. Long, P. C. Searson, and P. M. Vereecken, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2168050, 153, C258 (2006).
7. S. Bae and A. A. Gewirth, Langmuir, 22, 10315 (2006). 0743-7463
8. R. Alkire, T. Bergh, and R. L. Sani, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2131340, 125, 1981 (1978).
9. R. Sautebin, H. Froidevaux, and D. Landolt, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2129823, 127, 1096 (1980).
10. J. O. Dukovic, in Advances in Electrochemical Science and Engineering, H. Gerischer, and, C. Tobias, Editors, Vol. 3, p. 117, Wiley & Sons, New York (1994).
11. M. Georgiadou, D. Veyret, R. L. Sani, and R. C. Alkire, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1344540, 148, C54 (2001).
12. R. D. Braatz, R. C. Alkire, E. Seebauer, E. Rusli, R. Gunawan, T. O. Drews, X. Li, and Y. He, J. Process Control JPCOEO 0959-1524 10.1016/j.jprocont.2005.06.001, 16, 193 (2006).
13. D. G. Vlachos, A. B. Mhadeshwar, and N. S. Kaisare, Comput. Chem. Eng., 30, 1712 (2006). 0098-1354
14. Y. Qin, Ph.D. Thesis, University of Illinois at Urbana-Champaign, Urbana, IL (2006).
15. X. Li, Ph.D. Thesis, University of Illinois at Urbana-Champaign, Urbana, IL (2007).
16. J. S. Newman, Electrochemical Systems, p. 241, Prentice-Hall, Englewood Cliffs, NJ (1991).
17. J. A. Sethian, Level Set Methods and Fast Marching Methods, Cambridge University Press, New York (1999).
18. E. Rusli, Ph.D. Thesis, University of Illinois at Urbana-Champaign, Urbana, IL (2006).
19. D. Adalsteinsson and J. A. Sethian, J. Comput. Phys., 185, 271 (2003). 0021-9991
20. R. Akolkar and V. Dubin, Electrochem. Solid-State Lett. ESLEF6 1099-0062 10.1149/1.2717364, 10, D55 (2007).
21. R. Akolkar and U. Landau, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1799431, 151, C702 (2004).
22. T. P. Moffat, D. Wheeler, C. Witt, and D. Josell, Electrochem. Solid-State Lett. ESLEF6 1099-0062 10.1149/1.1521290, 5, C110 (1999).