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Volumn , Issue , 2009, Pages 390-397

Isothermal aging effects on the dynamic performance of lead-free solder joints

Author keywords

[No Author keywords available]

Indexed keywords

AGING EFFECTS; BGA PACKAGE; BOARD-LEVEL; DYNAMIC PERFORMANCE; ELECTRONIC PRODUCT; ELEVATED TEMPERATURE; END-USES; FCBGA PACKAGES; FLIP CHIP; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE SOLDER JOINT; SHOCK PERFORMANCE;

EID: 70349661438     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074044     Document Type: Conference Paper
Times cited : (11)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.