Electromigration in Pb-free solders

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Lu, Minhua ^a   Shih, Da Yuan ^a   Lauro, Paul ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; CAVITATION; CHEMICAL ENGINEERING; CHLORINE COMPOUNDS; COPPER; COPPER ALLOYS; DIFFUSION; DISSOLUTION; ELECTROMIGRATION; ELECTRONICS PACKAGING; FLUID MECHANICS; HYDRODYNAMICS; INTERMETALLICS; LEAD; LEAD ALLOYS; METAL RECOVERY; METALLIZING; METALS; NICKEL; NICKEL ALLOYS; ORES; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR DOPING; SILVER; SOLDERING ALLOYS; TECHNOLOGY; TIN ALLOYS; WELDING;

ANISOTROPIC DIFFUSION; C -AXIS; CURRENT DIRECTION; ELECTROMIGRATION (EM); ELECTRONIC PACKAGING; GRAIN ORIENTATIONS; HIGH-DENSITY PACKAGING; INTERMETALLIC COMPOUNDS; INTERNATIONAL CONFERENCES; LEAD-FREE SOLDERING; PB-FREE SOLDERS; RAPID DISSOLUTION; SELF DIFFUSIONS; STRESS TIME; UNDER-BUMP METALLURGY;

TIN;

EID: 52449101908     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607134     Document Type: Conference Paper

References (13)

1. Tu, K. N., et al., "Physics and Material Challenges for Lead-free Solders," J. Appl. Phys., Vol. 93, No. 3, (2003), pp. 1335-1353.
2. th Electronic Components and Technology Conf, San Diego, CA, May. 2006, pp. 131-138.
3. Dyson, B. F., Anthony, T.R., and Turnbull, D., "Interstitial Diffusion of Copper in Tin," J. Appl. Phys., Vol. 38, No. 8, (1967), p. 3408.
4. Yeh, D.C, and Huntington, H.B., " Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin," Phys. Rev. Lett., Vol. 53, No. 15, (1984) pp. 1469-1472.
5. Dyson, B. F., "Diffusion of Gold and Silver in Tin Single Crystals," J. Appl. Phys., Vol 37, No. 6, (1966), pp. 2375-2377.
6. th Electronic Components and Technology Conf., San Diego, CA, May. 2006, pp. 1462-1467.
7. Lu, M., et al., "Effect of Sn Grain Orientation on electromigration degradation mechanism in high Sn-based Pb-free Solders," Applied Physics Letters., Vol. 92, No. 21, (2008), p. 211909.
8. th Electronic Components and Technology Conf Lake Buena Vista, FL, May. 2008, pp. 360-365.
9. Sylvestre, J., and Blander, A., "Large-scale correlation in ther orientaiton of grains for lead- free solder bumps," to be published in J. Electronic Materials.
10. th Electronic Components and Technology Conf., San Diego, CA, May. 2006, pp. 1160-1163.
11. M. Lu, Unpublished data.
12. Chalmers, B., Physical SOC, 47, (1935), p 733.
13. Ho, C. E., Tsai, R.Y., Lin, Y. L., and Kao, C.R., "Effect of Cu concentration on the Reactions Between Sn-Ag-Cu solders and Ni," J. Electronic Materials, Vol. 31, 2002, p. 548.