Impact of the ROHS directive on high-performance electronic systems. Part I: Need for lead utilization in exempt systems

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 331-346

  Puttlitz, Karl J ^a   Galyon, George T ^b  

^a Puttlitz Engineering Consultancy LLC   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; LAWS AND LEGISLATION; RISK PERCEPTION; SOLDERED JOINTS; TIN ALLOYS;

EXEMPTION; HIGH-PERFORMANCE ELECTRONIC SYSTEMS; OPERATIONAL INTEGRITY;

SOLDERING ALLOYS;

EID: 33845697813     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9023-5     Document Type: Article

References (28)

1. "Directive 2002/95/EC of the European Parliament and the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipments," Official Journal of the European Union, Jan. 27, 2003
2. G. Galyon, Presentation to ERA representing the European Commission, Leatherhead, Surrey, UK, Aug. (2004)
3. K.J. Puttlitz, in Proc. International Seminar on Electronics: Lead-free technologies and recycling, Nov. 10-11, (Beijing, China, 2003), pp. 147-156
4. M. Wang, J. Zhu, J. Smetana, in Proc. International Seminar on Electronics: Lead-free technologies and recycling, Nov. 10-11, (Beijing, China 2003), pp. 173-178
5. Vicki Chin, in Proc. International Seminar on Electronics: Lead-free technologies and recycling, Nov. 10-11, (Beijing, China, 2003), pp. 162-166
6. David Towne, in Proc. International Seminar on Electronics: Lead-free technologies and recycling, Nov. 10-11, (Beijing, China, 2003), pp. 59-64
7. M.S. Cole, K.J. Puttlitz, Power Architecture Community Newsletter, http://www-128.ibm.com/developerworks/library/pa-ni15-community/ March 15, 2005
8. M.S. Cole, Presentation to ERA representing the European Commission, Leatherhead, Surrey, UK, Aug. 2004
9. R.D. Hilty, Tyco Electronics Communication to European Commission, Brussels, Belgium, July 1, 2004
10. R. Spiegel, Design News, Aug. 29, 2005
11. Naval Avionics Facility Indianapolis (NAFI), Interconnection Systems, http://www.albacom.co.uk/web/site/def_products/def_nafi.asp
12. K.J. Puttlitz, in Proc. International Seminar on Electronics, Lead-free technologies and recycling, Nov. 10-11, (Beijing, China, 2003), pp. 221-226
13. "Press-fit Technology" http://www.opt.de/english/ pressfit_technology/overview.htm
14. P. Isaacs, in Presentation to ERA representing the European Commission, Leatherhead, Surrey, UK, Aug. 2004
15. International Engineering Consortium, On-Line Education, http://www.iec.org/online/tutorials/signal_integrity/
16. R. Holt, June 21, 2005, http://www.connectorsupplier.com/ tech_updates_backplanes_6-21-05.htm
17. S. Nagarajan, "High-density Compliant Pin Connectors - Assembly Process Issues and Solutions, Electronics Manufacturing Research and Services (EMRS) Masters Abstracts, 2002, http://www.emrs.binghamton.edu/ thesis_ma02_nagas.html
18. N. Nguyen, G. Robertson, R. Schlak, T. Do, Printed Circuit Design, Nov. 2002, 12-13
19. G.J.S. Chou, R.D. Hilty, in Proc. of the IPC Anneal Meeting, Minneapolis, MN, Sept. 28-Oct. 2, 2003, 507-2-1 to 10
20. G.J.S. Chou, Tyco Electronics, Publication 503-2, Rev. A, Nov. 16, 2004
21. G.J.S. Chou, R.O. Hilty, in Proc. SMTA Inter. Conf., Chicago, IL, Sept 25-29, 2005, pp. 104-119
22. IEC 60352-5 Specification, "Solderless Connections - Part 5: Press-In Connections - General Requirements, Test Methods, and Practice Guidance," 2nd Edn, 2001
23. D. Parenti, Lead-Free Magazine, Nov. 9, 2005, http://www.leadfreemagazine.com/pages/vol005/ press_fit_components_vol5_1.html
24. IBM Archives, http://www.03.ibm.com/ibm/history/exhibits/vintage/ vintage_4506-2137.html
25. A.J. Blodgett, D.R. Barbour, IBM J. Res. Develop. 26 (1), 30 (2001)
26. J. Knickerbocker, G. Leung, W. Miller, S. Young, S. Sands, R. Indyk, IBM J. Res. Develop. 35 (3), 330 (1991)
27. M. Hoffmeyer, Presentation to ERA representing the European Commission, Leatherhead, Surrey, UK, Aug. 2004
28. K.J. Puttlitz, in Proc. International Seminar on Electronics: Lead-free technologies and recycling, Nov. 10-11, (Beijing, China, 2003), pp. 207-214