SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 10, 2009, Pages 2194-2200

Abnormal failure behavior of Sn-3.5Ag solder bumps under excessive electric current stressing conditions

(2) Lee, Jang Hee a Park, Young Bae b

a Hynix Semiconductor Inc (South Korea)

b Andong National University (South Korea)

Author keywords

Electromigration; Flip chip bump; Intermetallic compound; Pb free solder; Sn 3.5Ag

Indexed keywords

ABNORMAL BEHAVIOR; ABRUPT CHANGE; CU DIFFUSION; CU-SN INTERMETALLICS; DAMAGE EVOLUTION; ELECTRIC CURRENT STRESSING; ELECTRICAL FAILURES; FAILURE BEHAVIORS; FLIP CHIP; FLIP CHIP BUMP; INTERMETALLIC COMPOUND; MEAN TIME TO FAILURE; PB-FREE SOLDER; RESISTANCE INCREASE; SN-3.5AG; SOLDER BUMP; STANDARD DEVIATION; TEST CONDITION; TIME CURVES; UNDER-BUMP METALLURGIES;

ACTIVATION ENERGY; BRAZING; ELECTRIC CURRENT MEASUREMENT; ELECTRIC CURRENTS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTROMIGRATION; FLIP CHIP DEVICES; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; STATISTICAL TESTS; WELDING;

TIN;

EID: 69049106372 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0855-7 Document Type: Article

Times cited : (8)

References (24)

1
- 0032668835
- J.R. Lloyd 1999 J. Phys. D: Appl. Phys. 32 109
- (1999) J. Phys. D: Appl. Phys. , vol.32 , pp. 109
- Lloyd, J.R.¹

2
- 0035738589
- Y.B. Park D.W. Lee W.G. Lee 2001 J. Electron. Mater. 30 1569
- (2001) J. Electron. Mater. , vol.30 , pp. 1569
- Park, Y.B.¹ Lee, D.W.² Lee, W.G.³

3
- 2442544627
- I.S. Jeon Y.B. Park 2004 Microelectron. Reliab. 44 917
- (2004) Microelectron. Reliab. , vol.44 , pp. 917
- Jeon, I.S.¹ Park, Y.B.²

4
- 33947314489
- C.Y. Liu J.T. Chen Y.C. Chuang L. Ke S.J. Wang 2007 Appl. Phys. Lett. 90 112114
- (2007) Appl. Phys. Lett. , vol.90 , pp. 112114
- Liu, C.Y.¹ Chen, J.T.² Chuang, Y.C.³ Ke, L.⁴ Wang, S.J.⁵

5
- 33646412616
- Y.C. Chuang C.Y. Liu 2006 Appl. Phys. Lett. 88 174105
- (2006) Appl. Phys. Lett. , vol.88 , pp. 174105
- Chuang, Y.C.¹ Liu, C.Y.²

6
- 33747350507
- A.T. Huang K.N. Tu Y.S. Lai 2006 J. Appl. Phys. 100 033512
- (2006) J. Appl. Phys. , vol.100 , pp. 033512
- Huang, A.T.¹ Tu, K.N.² Lai, Y.S.³

7
- 37449022078
- J.W. Jang L.N. Ramanathan J. Tang D.R. Frear 2008 J. Electron. Mater. 37 185
- (2008) J. Electron. Mater. , vol.37 , pp. 185
- Jang, J.W.¹ Ramanathan, L.N.² Tang, J.³ Frear, D.R.⁴

8
- 33750497100
- B. Chao S.H. Chae X. Zhang K.-H. Lu M. Ding J. Im P.S. Ho 2006 J. Appl. Phys. 100 084909
- (2006) J. Appl. Phys. , vol.100 , pp. 084909
- Chao, B.¹ Chae, S.H.² Zhang, X.³ Lu, K.-H.⁴ Ding, M.⁵ Im, J.⁶ Ho, P.S.⁷

9
- 31644434548
- J.W. Nah F. Ren S. Venk G. Camara K.N. Tu 2006 J. Appl. Phys. 99 023520
- (2006) J. Appl. Phys. , vol.99 , pp. 023520
- Nah, J.W.¹ Ren, F.² Venk, S.³ Camara, G.⁴ Tu, K.N.⁵

10
- 30744460875
- S.H. Chiu T.L. Shao C. Chen D.J. Yao C.Y. Hsu 2006 Appl. Phys. Lett. 88 022110
- (2006) Appl. Phys. Lett. , vol.88 , pp. 022110
- Chiu, S.H.¹ Shao, T.L.² Chen, C.³ Yao, D.J.⁴ Hsu, C.Y.⁵

11
- 35348874185
- IEEE, Piscataway, NJ
- J.H. Lee, Y.D. Lee, and Y.B. Park, Proceedings of the 57th Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2007), pp. 1436-1441.
- (2007) Proceedings of the 57th Electronic Components and Technology Conference , pp. 1436-1441
- Lee, J.H.¹ Lee, Y.D.² Park, Y.B.³

12
- 33845564745
- IEEE, Piscataway, NJ
- S.-H. Chae, X. Zhang, H.-L. Chao, K.-H. Lu, and P.S. Ho, Proceedings of the 56th Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2006), pp. 650-656.
- (2006) Proceedings of the 56th Electronic Components and Technology Conference , pp. 650-656
- Chae, S.-H.¹ Zhang, X.² Chao, H.-L.³ Lu, K.-H.⁴ Ho, P.S.⁵

13
- 33646883535
- M. Ding G. Wang B. Chao P.S. Ho P. Su T. Uehling 2006 J. Appl. Phys. 99 094906
- (2006) J. Appl. Phys. , vol.99 , pp. 094906
- Ding, M.¹ Wang, G.² Chao, B.³ Ho, P.S.⁴ Su, P.⁵ Uehling, T.⁶

14
- 22944433854
- J.W. Nah J.O. Suh K.N. Tu 2005 J. Appl. Phys. 98 013715
- (2005) J. Appl. Phys. , vol.98 , pp. 013715
- Nah, J.W.¹ Suh, J.O.² Tu, K.N.³

15
- 7544230027
- T.L. Shao Y.H. Chen S.H. Chiu C. Chen 2004 J. Appl. Phys. 96 4518
- (2004) J. Appl. Phys. , vol.96 , pp. 4518
- Shao, T.L.¹ Chen, Y.H.² Chiu, S.H.³ Chen, C.⁴

16
- 14544277886
- Y.H. Lin Y.C. Hu C.M. Tsai C.R. Kao K.N. Tu 2005 Acta Mater. 53 2029
- (2005) Acta Mater. , vol.53 , pp. 2029
- Lin, Y.H.¹ Hu, Y.C.² Tsai, C.M.³ Kao, C.R.⁴ Tu, K.N.⁵

17
- 0036478448
- D.W. Lee B.Z. Lee J.Y. Jeong H. Park K.C. Shim J.S. Kim Y.B. Park S.W. Woo J.G. Lee 2002 Jpn. J. Appl. Phys. 41 557
- (2002) Jpn. J. Appl. Phys. , vol.41 , pp. 557
- Lee, D.W.¹ Lee, B.Z.² Jeong, J.Y.³ Park, H.⁴ Shim, K.C.⁵ Kim, J.S.⁶ Park, Y.B.⁷ Woo, S.W.⁸ Lee, J.G.⁹

18
- 84937650904
- J.R. Black 1969 IEEE Trans. Electron Dev. ED-164 338
- (1969) IEEE Trans. Electron Dev. , vol.164 , pp. 338
- Black, J.R.¹

19
- 0242721171
- W.J. Choi E.C.C. Yeh K.N. Tu 2003 J. Appl. Phys. 94 5665
- (2003) J. Appl. Phys. , vol.94 , pp. 5665
- Choi, W.J.¹ Yeh, E.C.C.² Tu, K.N.³

20
- 33747359377
- M.S. Yoon S.B. Lee O.H. Kim Y.B. Park Y.C. Joo 2006 J. Appl. Phys. 100 033715
- (2006) J. Appl. Phys. , vol.100 , pp. 033715
- Yoon, M.S.¹ Lee, S.B.² Kim, O.H.³ Park, Y.B.⁴ Joo, Y.C.⁵

21
- 33750495216
- C.Y. Liu L. Ke Y.C. Chuang S.J. Wang 2006 J. Appl. Phys. 100 083702
- (2006) J. Appl. Phys. , vol.100 , pp. 083702
- Liu, C.Y.¹ Ke, L.² Chuang, Y.C.³ Wang, S.J.⁴

22
- 0000315083
- S. Choi T.R. Bieler J.P. Lucas K.N. Subramanian 1999 J. Electron. Mater. 28 1208
- (1999) J. Electron. Mater. , vol.28 , pp. 1208
- Choi, S.¹ Bieler, T.R.² Lucas, J.P.³ Subramanian, K.N.⁴

23
- 0942277781
- C.-M. Chuang K.-L. Lin 2003 J. Electron. Mater. 32 1426
- (2003) J. Electron. Mater. , vol.32 , pp. 1426
- Chuang, C.-M.¹ Lin, K.-L.²

24
- 0032209640
- S.-W. Chen C.-M. Chen W.-C. Liu 1998 J. Electron. Mater. 27 1193
- (1998) J. Electron. Mater. , vol.27 , pp. 1193
- Chen, S.-W.¹ Chen, C.-M.² Liu, W.-C.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.