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Volumn 38, Issue 10, 2009, Pages 2132-2147

Effect of thermal aging on impact absorbed energies of solder joints under high-strain-rate conditions

Author keywords

Fracture surface; Impact absorbed energy; Impact test; Lead free solder joints; RE elements; Thermal aging

Indexed keywords

FRACTURE SURFACE; IMPACT ABSORBED ENERGY; IMPACT TEST; LEAD-FREE SOLDER JOINTS; RE ELEMENTS;

EID: 69049092596     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0872-6     Document Type: Article
Times cited : (6)

References (26)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.