Mechanics of adhesively bonded flip-chip-on-flex assemblies. Part I: Durability of anisotropically conductive adhesive interconnects

Journal of Adhesion Science and Technology

Volumn 22, Issue 14, 2008, Pages 1733-1756

  Haase, J ^a   Farley, D ^a   Iyer, P ^a   Baumgartner, P ^a   Dasgupta, A ^a   Caers, J F J ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Anisotropically conductive adhesives; Bonding pressure; Failure mechanisms; Finite element model; Flip chip on flex; Interconnect resistance; Parametric studies; Raleigh Ritz model; Thermal cycling test

Indexed keywords

ANISOTROPICALLY CONDUCTIVE ADHESIVES; BONDING PRESSURE; FAILURE MECHANISMS; FINITE ELEMENT MODEL; FLIP-CHIP-ON-FLEX; INTERCONNECT RESISTANCE; PARAMETRIC STUDIES; RALEIGH-RITZ MODEL; THERMAL CYCLING TEST;

ADHESIVE JOINTS; ADHESIVES; CONTACT RESISTANCE; DEGRADATION; DIES; DURABILITY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MACHINE DESIGN; MECHANISMS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; STRESSES; TESTING; THERMAL CYCLING; THERMAL EXPANSION; THERMAL SHOCK; VARIATIONAL TECHNIQUES;

FINITE ELEMENT METHOD;

EID: 68949083440     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X320564     Document Type: Article

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