A microvalve with integrated sensors and customizable normal state for low-temperature operation

Journal of Microelectromechanical Systems

Volumn 18, Issue 4, 2009, Pages 868-877

  Park, Jong M ^a,b   Evans, Allan T ^a   Rasmussen, Kristian ^c   Brosten, Tyler R ^c   Nellis, Gregory F ^c   Klein, Sanford A ^c   Gianchandani, Yogesh B ^b  

^a UNIVERSITY OF MICHIGAN   (United States)

^b Honeywell ACS Sensors and Wireless Laboratory   (United States)

^c University of Wisconsin Madison   (United States)

Author keywords

Cooling systems; Cryogenic; Microelectromechanical systems (MEMS); Piezoelectric; Piezoresistive pressure sensor; Resistance temperature detector (RTD)

Indexed keywords

ASSEMBLY PROCESS; CUSTOMIZABLE; DISTRIBUTED COOLING; EFFECT OF TEMPERATURE; FLOW MODULATIONS; GAS-FLOW MODULATION; GLASS WAFER; INTEGRATED SENSORS; LOW TEMPERATURES; MICRO VALVES; MICROELECTROMECHANICAL SYSTEMS (MEMS); MICROMACHINED; NORMAL STATE; PIEZOELECTRIC; PIEZOELECTRIC STACK ACTUATORS; PIEZORESISTIVE PRESSURE SENSOR; PIEZORESISTIVE PRESSURE SENSORS; RESISTANCE TEMPERATURE DETECTOR (RTD); RESISTANCE TEMPERATURE DETECTORS; ROOM TEMPERATURE; SILICON DIE; SILICON ON INSULATOR WAFERS; TEMPERATURE COEFFICIENT; TEMPERATURE STABILITY; THIN-FILMS;

COMPOSITE MICROMECHANICS; COOLING; COOLING SYSTEMS; CRYOGENICS; DETECTORS; DIES; ELECTRON TUBE DIODES; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; MODULATION; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; PLATINUM; PRESSURE SENSORS; PRESSURE TRANSDUCERS; RESONANT TUNNELING; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DIODES; SILICON WAFERS; TEMPERATURE MEASURING INSTRUMENTS; TEMPERATURE SENSORS; THERMOANALYSIS; THERMOELECTRIC EQUIPMENT; VALVES (MECHANICAL);

THERMAL EFFECTS;

EID: 68849123061     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2021097     Document Type: Article

References (46)

1. D. J. Benford, M. J. Amato, J. C. Mather, S. H. Moseley, Jr., and D. T. Leisawitz, "Mission concept for the single aperture far-infrared (SAFIR) observatory," Astrophys. Space Sci., vol. 294, no. 3/4, pp. 177-212, Dec. 2004.
2. L. J. Hastings, D. W. Plachta, L. Salerno, and P. Kittel, "An overview of NASA efforts on zero boiloff storage of cryogenic propellants," Cryogenics, vol. 41, no. 11/12, pp. 833-839, Nov. 2001.
3. S. C. Terry, J. H. Jerman, and J. B. Angell, "A gas chromatographic air analyzer fabricated on a silicon wafer," IEEE Trans. Electron Devices, vol. ED-26, no. 12, pp. 1880-1886, Dec. 1979.
4. T. Ikehara, H. Yamagishi, and K. Ikeda, "Electromagnetically driven silicon microvalve for large-flow pneumatic controls," in Proc. SPIE 1997, vol. 3242, pp. 136-144.
5. Y. Shinozawa, T. Abe, and T. Kondo, "A proportional microvalve using a bi-stable magnetic actuator," in Proc. IEEE Int. Workshop MEMS, Nagoya, Japan, Jan. 1997, pp. 233-237.
6. C. Fu, Z. Rummler, and W. Schomburg, "Magnetically driven micro ball valves fabricated by multilayer adhesive film bonding," J. Micromech. Microeng., vol. 13, no. 4, pp. S96-S102, Jul. 2003.
7. P. Dubois, B. Guldimann, and N. F. de Rooij, "High-speed electrostatic gas microvalve switching behavior," in Proc. SPIE, 2001, vol. 4560, pp. 217-226.
8. J. Collier, D. Wroblewski, and T. Bifano, "Development of a rapid-response flow-control system using MEMS microvalve arrays," J. Microelectromech. Syst., vol. 13, no. 6, pp. 912-922, Dec. 2004.
9. N. Vandelli, D. Wroblewski, M. Velonis, and T. Bifano, "Development of a MEMS microvalve array for fluid flow control," J. Microelectromech. Syst., vol. 7, no. 4, pp. 395-403, Dec. 1998.
10. M. A. Huff, J. R. Gilbert, and M. A. Schmidt, "Flow characteristics of a pressure-balanced microvalve," in Proc. IEEE Int. Conf. Solid-State Sens. Actuators (TRANSDUCERS), Yokohama, Japan, Jun. 1993, pp. 98-101.
11. J. K. Robertson and K. D. Wise, "A nested electrostatically-actuated microvalve for an integrated microflow controller," in Proc. IEEE Int. Workshop MEMS, Oiso, Japan, Jan. 1994, pp. 7-12.
12. M. J. Zdeblick and J. B. Angell, "A microminiature electric-to-fluidic valve," in Proc. IEEE Int. Conf. Solid-State Sens. Actuators (TRANSDUCERS), Chicago, IL, Jun. 1987, pp. 437-439.
13. C. A. Rich and K. D. Wise, "A high-flow thermopneumatic microvalve with improved efficiency and integrated state sensing," J. Microelectromech. Syst., vol. 12, no. 2, pp. 201-208, Apr. 2003.
14. P. W. Barth, C. C. Beatty, L. A. Field, J. W. Baker, and G. B. Gordon, "A robust normally-closed silicon microvalve," in Solid-State Sens. Actuator Workshop, Hilton Head Island, SC, Jun. 1994, pp. 248-250.
15. P. W. Barth and G. Gordon, "High performance micromachined valve orifice and seat," U.S. Patent 5 333 831, Aug. 2, 1994.
16. S. Messner, M. Muller, V. Burger, J. Schaible, H. Sandmaier, and R. Zengerle, "A normally-closed, bimetallically actuated 3-way microvalve for pneumatic applications," in Proc. IEEE Int. Workshop MEMS, Heidelberg, Germany, Jan. 1998, pp. 40-44.
17. M. Kohl, D. Dittmann, E. Quandt, and B. Winzek, "Thin film shape memory microvalves with adjustable operation temperature," Sens. Actuators A, Phys., vol. 83, no. 1-3, pp. 214-219, May 2000.
18. E. H. Yang, C. Lee, J. Mueller, and T. George, "Leak-tight piezoelectric microvalve for high-pressure gas micropropulsion," J. Microelectromech. Syst., vol. 13, no. 5, pp. 799-807, Oct. 2004.
19. C. Lee, E. H. Yang, S. M. Saeidi, and J. M. Khodadadi, "Fabrication, characterization, and computational modeling of piezoelectrically actuated microvalve for liquid flow control," J. Microelectromech. Syst., vol. 15, no. 3, pp. 686-696, Jun. 2006.
20. J. M. Park, R. P. Taylor, A. T. Evans, T. R. Brosten, G. F. Nellis, S. A. Klein, J. R. Feller, L. Salerno, and Y. B. Gianchandani, "A piezoelectric microvalve for cryogenic applications," J. Micromech. Microeng., vol. 18, no. 1, p. 015 023, Jan. 2008.
21. J. M. Park, T. R. Brosten, A. T. Evans, K. Rasmussen, G. F. Nellis, S. A. Klein, J. R. Feller, L. Salerno, and Y. B. Gianchandani, "A piezoelectric microvalve with integrated sensors for cryogenic applications," in Proc. 20th IEEE Int. Conf. MEMS, Kobe, Japan, Jan. 2007, pp. 647-650.
22. J. Franz, H. Baumann, and H.-P. Trah, "A silicon microvalve with integrated flow sensor," in 8th Int. Conf. Solid-State Sens. Actuators (TRANSDUCERS), Stockholm, Sweden, Jun. 1995, vol. 2, pp. 313-316.
23. M. E. Piccini and C. B. Towe, "A shape memory alloy microvalve with flow sensing," Sens. Actuators A, Phys., vol. 128, no. 2, pp. 344-349, Apr. 2006.
24. S. K. Clark and K. D. Wise, "Pressure sensitivity in anisotropically etched thin-diaphragm pressure sensors," IEEE Trans. Electron Devices, vol. ED-26, no. 12, pp. 1887-1896, Dec. 1979.
25. S. T. Cho, K. Najafi, and K. D. Wise, "Internal stress compensation and scaling in ultrasensitive silicon pressure sensors," IEEE Trans. Electron Devices, vol. 39, no. 4, pp. 836-842, Apr. 1992.
26. C. J. Yeager, "A review of cryogenic thermometry and common temperature sensors," IEEE Sensors J., vol. 1, no. 4, pp. 352-360, Dec. 2001.
27. S. S. Courts, P. R. Swinehart, and C. J. Yeager, "A new cryogenic diode thermometer," in AIP Conf. Proc., 2002, pp. 1620-1627.
28. R. P. Taylor, G. F. Nellis, S. A. Klein, D. W. Hoch, J. Feller, P. Roach, J. M. Park, and Y. Gianchandani, "Measurements of the material properties of a laminated piezoelectric stack at cryogenic temperatures," in Proc. 30th Int. Cryogenic Mater. Conf., Keystone, CO, Aug. 2005, pp. 200-207.
29. T. R. Brosten, "Model and test of an actively controlled cryogenic micro valve," M.S. thesis, Dept. Mech. Eng., Univ. Wisconsin, Madison, WI, 2006. [Online]. Available: http://sel.me.wisc.edu/publications/theses/theses2.html
30. T. R. Brosten, J. M. Park, A. T. Evans, K. Rasmussen, G. F. Nellis, S. A. Klein, J. R. Feller, L. Salerno, and Y. B. Gianchandani, "A numerical flow model and experimental results of a cryogenic micro-valve for distributed cooling applications," Cryogenics, vol. 47, no. 9/10, pp. 501-509, Sep./Oct. 2007.
31. E. B. Arkilic, M. A. Schmidt, and K. S. Breuer, "Gaseous slip flow in long microchannels," J. Microelectromech. Syst., vol. 6, no. 2, pp. 167-178, Jun. 1997.
32. S. A. Kleinin Engineering Equation Solver. Madison, WI: Univ. Wisconsin, 2002. [Online]. Available: http://sel.me.wisc.edu/ees/ new_ees.html
33. A. P. Zhernov, "Lattice constant and coefficient of linear thermal expansion of the silicon crystal. Influence of isotopic composition," Low Temp. Phys., vol. 26, no. 12, pp. 908-915, Dec. 2000.
34. R. M. Buffington and W. M. Latimer, "Coefficients of expansion at low temperatures and thermodynamic applications of expansion data," J. Amer. Chem. Soc., vol. 48, no. 9, pp. 2305-2319, Sep. 1926.
35. A. T. Evans, J. M. Park, G. F. Nellis, S. A. Klein, J. R. Feller, L. Salerno, and Y. B. Gianchandani, "A low power, micro valve-regulated drug delivery system using a Si micro-spring pressurized balloon reservoir," in Proc. 14th Int. Conf. Solid-State Sens., Actuators Microsyst. (TRANDUCERS), Tucson, AZ, 2007, pp. 359-362.
36. A. T. Evans, J. M. Park, S. Chiravuri, and Y. B. Gianchandani, "Dual drug delivery device for chronic pain management using micromachined elastic metal structures and silicon microvalves," in Proc. 21st IEEE Int. Conf. MEMS, 2008, pp. 252-255.
37. W. Kern and C. Deckert, "Chemical etching," in Thin Film Processes J. L. Vossen and W. Kern, Eds. New York: Academic, 1978.
38. S.-C. Kim and K. D. Wise, "Temperature sensitivity in silicon piezoresistive pressure transducers," IEEE Trans. Electron Devices vol. ED-30, no. 7, pp. 802-810, Jul. 1983.
39. Y. Kanda, "Graphical representation of the piezoresistance coefficients in silicon," IEEE Trans. Electron Devices, vol. ED-29, no. 1, pp. 64-70, Jan. 1982.
40. U. Aljancic, D. Resnik, D. Vrtacnik, M. Mozek, and S. Amon, "Temperature effects modeling in silicon piezoresistive pressure sensor," in Proc. IEEE Mediterranean Electrotechnical Conf., Cairo, Egypt, May 2002, pp. 36-40.
41. G. Kowalski, "Miniature pressure sensors and their temperature compensation," Sens. Actuators, vol. 11, no. 4, pp. 367-376, May 1987.
42. P. Kopystynski and E. Obermeier, "An interchangeable silicon pressure sensor with on-chip compensation circuitry," Sens. Actuators, vol. 18, no. 3/4, pp. 239-245, Jul. 1989.
43. J. Bryzek, R. Mayer, and P. Barth, "New generation of disposable blood pressure sensors with digital on-chip laser trimming," in Proc. IEEE Solid State Sens. Actuator Workshop, Hilton Head Island, SC, Jun. 1988, pp. 121-122.
44. T. Ishihara, K. Suzuki, S. Suwazono, M. Hirata, and H. Tanigawa, "CMOS integrated silicon pressure sensor," IEEE J. Solid-State Circuits vol. SSC-22, no. 2, pp. 151-156, Apr. 1987.
45. W. H. Ko, J. T. Suminto, and G. J. Yeh, "Bonding techniques for microsensors," in Micromachining and Micropackaging of Transducers vol. 20. Amsterdam, The Netherlands: Elsevier, 1985, pp. 41-61.
46. M. M. Nayak, N. Gunasekaran, A. E. Muthunayagam, K. Rajanna, and S. Mohan, "Diaphragm-type sputtered platinum thin film strain gauge pressure transducer," Meas. Sci. Technol., vol. 4, no. 12, pp. 1319-1322, Dec. 1993.