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Surface Engineering

Volumn 25, Issue 5, 2009, Pages 389-392

Effect of pulse parameter on pulsed electrodeposition of copper on stainless steel

(5) Balasubramanian, A a Srikumar, D S a Raja, G a Saravanan, G a Mohan, S a

a CENTRAL ELECTROCHEMICAL RESEARCH INSTITUTE (India)

Author keywords

Duty cycle; Grain size; Off time; On time; Pulsed electrodeposition

Indexed keywords

DUTY CYCLE; GRAIN SIZE; OFF TIME; ON TIME; PULSED ELECTRODEPOSITION;

CHLORINE COMPOUNDS; COPPER; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; HYDROCHLORIC ACID;

STAINLESS STEEL;

EID: 68049127722 PISSN: 02670844 EISSN: None Source Type: Journal
DOI: 10.1179/026708408X344680 Document Type: Article

Times cited : (60)

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