Copper bottom-up filling by electroplating without any additives on patterned wafer

Electrochemical and Solid-State Letters

Volumn 10, Issue 2, 2007, Pages

  Cha, Seung Hwan ^a   Kim, Seung Soo ^b   Cho, Sung Ki ^b   Kim, Jae Jeong ^b  

^a LG Display Co Ltd   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; COPPER; CRYSTAL DEFECTS; ELECTROCHEMISTRY; ELECTROPLATING; ETCHING;

ELECTROCHEMICAL OXIDATION; PULSE PLATING; WAFER;

METALLIC FILMS;

EID: 33845939277     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2400207     Document Type: Article

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