Influence of pulse plating parameters on morphology and hardness of pure tin deposit

Transactions of the Institute of Metal Finishing

Volumn 86, Issue 2, 2008, Pages 115-121

  Hansal, W E G ^a   Halmdienst, M ^a   Hansal, S ^a   Boussaboua, I ^a,b   Darchen, A ^b  

^a Happy Plating GmbH   (Austria)

^b UNIV RENNES   (France)

Author keywords

Alkaline stannate electrolyte; Microhardness; Pulse plating; Tin

Indexed keywords

CURRENT DENSITY; ELECTROLYTES; PLATING; TIN COMPOUNDS;

ALKALINE STANNATE ELECTROLYTES; PULSE PLATING PARAMETERS; PURE TIN DEPOSIT;

COATINGS;

EID: 44449090536     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/174591908X272960     Document Type: Article

References (12)

1. M. Jordan: 'The electrodeposition of tin and its alloys', 19-59; 1995, Saulgau, Eugen G. Leuze Publishers.
2. F. A. Lowenheim: 'Electroplating', 311; 1995, Bristol, Technical Reference Publications.
3. Y. Liu and M. Pritzker: J. Appl. Electrochem., 2003, 33, 1143-1153.
4. K. L. Lin and L. M. Sun: J. Mater. Res., 2003, 18, 2203-2207.
5. J. C. Puippe and F. Leaman (eds.): 'Theory and practice of pulse plating', 192; 1986, Orlando, FL, American Electroplaters and Surface Finishers Society.
6. C. S. Chen, C. C. Wan and Y. Y. Wang: Trans. IMF, 1998, 76, 56.
7. C. A. Gervasi, F. E. Varela, J. R. Vilche and P. E. Alvarez: Electrochim. Acta, 1997, 42, 537-547.
8. L. Peter, Q. Liu, Z. Kerner and I. Bakonyi: Electrochim. Acta, 2004, 49, 1513-1526.
9. M. Halmdienst, W. E. G. Hansal, G. Kaltenhauser and W. Kautek: Trans. IMF, 2007, 85, 22-26.
10. W. E. G. Hansal et al.: Electrochimica Acta, 2006, 52, 1145-1151.
11. C. Kerr: Proc. AESF Interfinish Conf., Chicago, IL, USA, June 2004, AESF.
12. P. E. Alvarez and C. A. Gervasi: Corros. Sci., 2004, 46, 91-107.