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Volumn 41, Issue 1, 2005, Pages 82-86
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Throwing power of a dilute sulfuric acid copper plating electrolyte during intensive electrodeposition
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Author keywords
Electrodeposition; Electrolyte; Hull cell; Rotating cylindrical electrode; Throwing power
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Indexed keywords
COPPER PLATING;
CURRENT DENSITY;
DIFFUSION;
ELECTRODEPOSITION;
ELECTROLYTES;
FORCED CONVECTION;
CATHODIC POLARIZABILITY;
COPPER PLATING ELECTROLYTES;
HULL CELL;
THROWING POWER (TP);
SULFURIC ACID;
COPPER;
ELECTROLYTE;
OXYGEN;
SULFUR;
SULFURIC ACID;
ARTICLE;
DENSITY;
DIFFUSION;
ELECTROCHEMISTRY;
ELECTRODE;
METHODOLOGY;
POLARIZATION;
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EID: 15044345521
PISSN: 10231935
EISSN: None
Source Type: Journal
DOI: 10.1007/s11175-005-0009-z Document Type: Article |
Times cited : (2)
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References (8)
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