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Volumn 41, Issue 1, 2005, Pages 82-86

Throwing power of a dilute sulfuric acid copper plating electrolyte during intensive electrodeposition

Author keywords

Electrodeposition; Electrolyte; Hull cell; Rotating cylindrical electrode; Throwing power

Indexed keywords

COPPER PLATING; CURRENT DENSITY; DIFFUSION; ELECTRODEPOSITION; ELECTROLYTES; FORCED CONVECTION;

EID: 15044345521     PISSN: 10231935     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11175-005-0009-z     Document Type: Article
Times cited : (2)

References (8)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.