The effect of additives on the pulsed electrodeposition of copper

Transactions of the Institute of Metal Finishing

Volumn 83, Issue 4, 2005, Pages 194-198

  Mohan, S ^a   Raj, V ^a  

^a CENTRAL ELECTROCHEMICAL RESEARCH INSTITUTE   (India)

Author keywords

Copper; Current efficiency; Duty cycle; Frequency; Pulse plating; Throwing power

Indexed keywords

ADDITIVES; COPPER COMPOUNDS; COPPER PLATING; CURRENT DENSITY; ELECTROCHEMISTRY; GLYCOLS; POLYETHYLENES; SODIUM COMPOUNDS;

COPPER SULFATE BATH; CURRENT EFFICIENCY; FREQUENCY; PULSE DUTY CYCLES; PULSE PLATING; PULSED ELECTRODEPOSITION; THROWING POWER;

ELECTRODEPOSITION;

EID: 26644442149     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/002029605X61595     Document Type: Article

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