Influence of pulse plating parameters on the electrocodeposition of matrix metal nanocomposites

Electrochimica Acta

Volumn 52, Issue 25, 2007, Pages 7362-7371

  Thiemig, Denny ^a   Lange, Ronny ^a   Bund, Andreas ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Alumina; Copper; Electrocodeposition; Nanocomposite; Nickel; Pulse plating

Indexed keywords

ALUMINA; COPPER; ELECTRODEPOSITION; ELECTROLYTES; NANOCOMPOSITES; NICKEL;

ELECTROCODEPOSITION; PULSE PLATING; PULSE REVERSE PLATING (PRP);

METALLIC MATRIX COMPOSITES;

EID: 34547510578     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.06.009     Document Type: Article

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