Barrier capability of Zr-N films with titanium addition against copper diffusion

Materials Chemistry and Physics

Volumn 117, Issue 2-3, 2009, Pages 425-429

  Wang, Ying ^a   Cao, Fei ^a   Yang, Xiao dong ^a   Ding, Ming hui ^a  

^a HARBIN ENGINEERING UNIVERSITY   (China)

Author keywords

Cu interconnection; Diffusion barrier; Magnetron sputtering; Zr Ti N

Indexed keywords

BARRIER CAPABILITY; BARRIER LAYERS; CONTACT SYSTEMS; COPPER DIFFUSION; CU DIFFUSION; CU INTERCONNECTION; CU METALLIZATION; HIGH THERMAL STABILITY; LOCAL DEFECTS; MATERIAL ANALYSIS; SHEET RESISTANCE MEASUREMENTS; SI PRECIPITATES; SI SUBSTRATES; SPUTTERING DEPOSITION; THERMAL STABILITY; TI ATOMS; XPS; XPS ANALYSIS; XRD; ZR-TI-N; ZRN FILMS;

COPPER; DIFFUSION BARRIERS; ELECTRIC RESISTANCE; GRAIN BOUNDARIES; MAGNETRONS; METALLIC FILMS; PHASE INTERFACES; QUALITY ASSURANCE; SHEET RESISTANCE; SYSTEM STABILITY; THERMODYNAMIC STABILITY; TITANIUM; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

ZIRCONIUM;

EID: 67651221912     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2009.06.029     Document Type: Article

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