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Volumn 50, Issue 1-4, 2000, Pages 509-513

Analysis of Ti-Si-N diffusion barrier films obtained by r.f. Magnetron sputtering

Author keywords

Diffusion barrier; HRTEM; Magnetron; Ti Si N

Indexed keywords

AMORPHOUS FILMS; ARGON; ELECTRIC CONDUCTIVITY OF SOLIDS; ENERGY DISPERSIVE SPECTROSCOPY; GRAIN SIZE AND SHAPE; INTERDIFFUSION (SOLIDS); MAGNETRON SPUTTERING; NANOSTRUCTURED MATERIALS; NITROGEN COMPOUNDS; THIN FILMS; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 0033640089     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00321-4     Document Type: Article
Times cited : (15)

References (8)
  • 1
    • 0001487924 scopus 로고    scopus 로고
    • Reactively sputtered Ti-Si-N films. II: Diffusion barriers for Al and Cu metallizations on Si
    • Sun X., Reid J.S., Kolawa E., Nicolet M.-A., Ruiz R.P. Reactively sputtered Ti-Si-N films. II: Diffusion barriers for Al and Cu metallizations on Si. J. Appl. Phys. 81:1997;664-671.
    • (1997) J. Appl. Phys. , vol.81 , pp. 664-671
    • Sun, X.1    Reid, J.S.2    Kolawa, E.3    Nicolet, M.-A.4    Ruiz, R.P.5
  • 4
    • 0342947447 scopus 로고
    • Sputter deposition
    • D.S. Rickerby, & A. Matthews. Glasgow, UK: Blackie
    • Rohde S.L., Münz W.-D. Sputter deposition. Rickerby D.S., Matthews A. Advanced Surface Coating. 1991;92-126 Blackie, Glasgow, UK.
    • (1991) Advanced Surface Coating , pp. 92-126
    • Rohde, S.L.1    Münz, W.-D.2
  • 6
    • 0031152731 scopus 로고    scopus 로고
    • Diffusion barrier properties of TaC between Si and Cu
    • Imahori J., Oku T., Murakami M. Diffusion barrier properties of TaC between Si and Cu. Thin Solid Films. 301:1997;142-148.
    • (1997) Thin Solid Films , vol.301 , pp. 142-148
    • Imahori, J.1    Oku, T.2    Murakami, M.3
  • 7
    • 0342357272 scopus 로고    scopus 로고
    • Reactively sputtered Ti-Si-N films. I: Physical properties
    • Sun X., Reid J.S., Kolawa E., Nicolet M.-A. Reactively sputtered Ti-Si-N films. I: Physical properties. J. Appl. Phys. 81:1997;656-663.
    • (1997) J. Appl. Phys. , vol.81 , pp. 656-663
    • Sun, X.1    Reid, J.S.2    Kolawa, E.3    Nicolet, M.-A.4
  • 8
    • 0004741579 scopus 로고    scopus 로고
    • Correlation of W-Si-N film microstructure with barrier performance against Cu diffusion
    • Shimooka Y., Iijima T., Nakamure S., Suguro K. Correlation of W-Si-N film microstructure with barrier performance against Cu diffusion. Jpn. J. Appl. Phys. 36:1997;1589-1592.
    • (1997) Jpn. J. Appl. Phys. , vol.36 , pp. 1589-1592
    • Shimooka, Y.1    Iijima, T.2    Nakamure, S.3    Suguro, K.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.