Thermal stability and interface diffusion behaviors of electrolessly deposited CoWP and Cu films

Journal of the Electrochemical Society

Volumn 155, Issue 3, 2008, Pages

  Chang, Shou Yi ^a,b   Lu, Chia Ling ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTALLIZATION; DIFFUSION BARRIERS; ELECTROLESS PLATING; ELECTROMIGRATION; THERMODYNAMIC STABILITY;

INTERFACE DIFFUSION BEHAVIORS; STABLE CONCENTRATIONS;

THIN FILMS;

EID: 38349104355     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2829890     Document Type: Article

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