Electromigration time to failure of SnAgCuNi solder joints

Journal of Applied Physics

Volumn 106, Issue 1, 2009, Pages

  Basaran, Cemal ^a   Li, Shidong ^a   Hopkins, Douglas C ^a   Veychard, Damien ^b  

^a UNIVERSITY AT BUFFALO   (United States)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL RESISTIVITY; SOLDER JOINTS; TIME TO FAILURE;

ACTIVATION ENERGY; BRAZING; ELECTRIC RESISTANCE; ELECTROMIGRATION; MICROELECTRONICS; SILVER; WELDING;

TIN;

EID: 67650714436     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3159012     Document Type: Article

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