Experimental study on electric-current induced damage evolution at the crack tip in thin film conductors

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 4, 1998, Pages 354-359

  Bastawros, A F ^a   Kim, K S ^b  

^a HARVARD UNIVERSITY   (United States)

^b Brown University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BRITTLE FRACTURE; CONDUCTIVE FILMS; CRACK PROPAGATION; ELECTRIC CURRENTS; ELECTRIC HEATING; FAILURE ANALYSIS; FRACTURE TOUGHNESS; GOLD; METALLIC FILMS; TEMPERATURE DISTRIBUTION; THIN FILMS;

CRITICAL CURRENT INTENSITY FACTOR; CURRENT INTENSITY RATE; INTERCONNECT LINES; THIN FILM CONDUCTOR;

ELECTRONICS PACKAGING;

EID: 0032301915     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792646     Document Type: Article

References (10)

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3. Bastawros, A.-F., and Kim, K.-S, 1995, “Electro-Thermal Crack Growth Caused by Electric-Current Intensification,” Proceedings, Application of Fracture Mechanics in Electronic Packaging and Materials, EEP-1 l/MD-64, ASME, New York, pp. 238-244.
4. Bastawros, A.-F., and Kim, K.-S, 1997, “The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Films,” Proceedings, Application of Fracture Mechanics in Electronic Packaging, EEP-20/AMD-222, ASME, New York, pp. 139-144.
5. EchoTherm Manual, 1997, Version 4.2, Thermal Wave Imaging Inc., Lathrup Village, MI.
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9. Saka, M., Sasagawa, K., and Abe, H., 1994, “Theoretical Analysis of Electrothermal Crack Problem Considering Thomson Effect,” Proceedings, ASME meeting, AMD-193, pp. 53-59.
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