A computational damage mechanics model for thermomigration

Mechanics of Materials

Volumn 41, Issue 3, 2009, Pages 271-278

  Li, Shidong ^a   Basaran, Cemal ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CONTINUUM MECHANICS; ELASTICITY; ELECTRONICS PACKAGING; THERMAL GRADIENTS;

DAMAGE EVOLUTIONS; DAMAGE MECHANICS MODELS; ENTROPY PRODUCTION RATES; FINITE ELEMENTS; HEAT TRANSFER EQUATIONS; HIGH CURRENT DENSITIES; HIGH TEMPERATURE GRADIENTS; LABORATORY TESTS; MASS TRANSPORTS; NANO-SCALE; SOLDER JOINTS; THERMOMIGRATION;

WELDING;

EID: 60649115832     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechmat.2008.10.013     Document Type: Article

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