Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

Precision Engineering

Volumn 33, Issue 4, 2009, Pages 378-386

  Yan, Jiwang ^a   Asami, Tooru ^a   Harada, Hirofumi ^b   Kuriyagawa, Tsunemoto ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b Siltronic Japan Corporation   (Japan)

Author keywords

Dislocation; Ductile machining; High pressure; Nano precision cutting; Phase transformation; Single crystal silicon; Subsurface damage

Indexed keywords

DISLOCATION; DUCTILE MACHINING; HIGH PRESSURE; NANO PRECISION CUTTING; PHASE TRANSFORMATION; SINGLE CRYSTAL SILICON; SUBSURFACE DAMAGE;

CRYSTAL CUTTING; CRYSTALLINE MATERIALS; DIAMONDS; MACHINING; RAMAN SPECTROSCOPY; SILICON WAFERS; SINGLE CRYSTALS; TRANSMISSION ELECTRON MICROSCOPY;

DISLOCATIONS (CRYSTALS);

EID: 67650482275     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.precisioneng.2008.10.008     Document Type: Article

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