Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration

Microelectronics Reliability

Volumn 46, Issue 12, 2006, Pages 2104-2111

  Chen, Kuo Ming ^a   Wu, J D ^b   Chiang, Kuo Ning ^c  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTROMIGRATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; SOLDERING ALLOYS; THIN FILMS;

EUTECTIC SOLDER BUMP ELECTROMIGRATION; HIGH TEMPERATURE OPERATION LIFE TEST (HTOL); MEDIAN TIME TO FAILURE (MTTF); UNDER BUMP METALLIZATION (UBM);

EUTECTICS;

EID: 33748930042     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.01.005     Document Type: Article

References (11)

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