SCOPUS 정보 검색 플랫폼

Microsystem Technologies

Volumn 15, Issue 1 SPEC. ISS., 2009, Pages 17-25

A simple method for testing the electromigration resistance of solders

(4) Saka, M a Kohara, T a Hasegawa, T a Yamashita, M b

a TOHOKU UNIVERSITY (Japan)

b FUJI ELECTRIC CO (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CURVE FITTING; DIAMOND FILMS; DIAMONDS; ELECTRIC NETWORK ANALYSIS; FREE VOLUME; LEAD; LEAD ALLOYS; MELTING POINT; NANOSTRUCTURED MATERIALS; SOLDERING; SOLDERING ALLOYS; THERMOCHEMISTRY; THICK FILMS; WELDING;

ATOMIC FLUX DIVERGENCES; BEAM SYSTEMS; CHEMICAL REAGENTS; CURRENT FLOWS; CURRENT SUPPLIES; DIRECT CURRENTS; DIRECT METHODS; ELECTROMIGRATION RESISTANCES; EXTENDING; HIGH-DENSITY; LOCAL TEMPERATURES; MEASURING; PRESENT METHODS; REMAINED CONSTANTS; SHAPED HOLES; SIMPLE METHODS; SMALL AREAS; SOLDER BUMP INTERCONNECTS; SOLDER BUMPS; STEADY TEMPERATURES; THEORETICAL ANALYSES;

ELECTROMIGRATION;

EID: 54049142050 PISSN: 09467076 EISSN: None Source Type: Journal
DOI: 10.1007/s00542-008-0642-z Document Type: Conference Paper

Times cited : (6)

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