Thermoplastic polymer patterning without residual layer by advanced nanoimprinting schemes

Nanotechnology

Volumn 20, Issue 24, 2009, Pages

  Park, Hyunsoo ^a   Cheng, Xing ^a  

^a Texas AandM University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TECHNIQUES; DE-WETTING; NANO-IMPRINTING; NANO-IMPRINTING PROCESS; NANOSCALE PATTERNING; NEW APPLICATIONS; ORGANIC ELECTRONIC DEVICES; POLYMER SCAFFOLDS; RESIDUAL LAYERS; THERMOPLASTIC POLYMER; VACUUM ENVIRONMENT;

CONJUGATED POLYMERS; FUNCTIONAL MATERIALS; LITHOGRAPHY; ORGANIC POLYMERS; OXYGEN; POLYMERS; REACTIVE ION ETCHING;

FUNCTIONAL POLYMERS;

NANOMATERIAL; OXYGEN; POLYMER; SOLVENT;

ARTICLE; DEVICE; HIGH TEMPERATURE; METHODOLOGY; NANOANALYSIS; PRIORITY JOURNAL; VACUUM; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; HEAT; MACROMOLECULE; MATERIALS TESTING; NANOTECHNOLOGY; PARTICLE SIZE; SURFACE PROPERTY; ULTRASTRUCTURE;

CRYSTALLIZATION; HOT TEMPERATURE; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MOLECULAR CONFORMATION; NANOSTRUCTURES; NANOTECHNOLOGY; PARTICLE SIZE; POLYMERS; SURFACE PROPERTIES;

EID: 67649228961     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/20/24/245308     Document Type: Article

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