-
2
-
-
0022012317
-
Mechanical properties of composition modulated Cu-Ni foils
-
Baral D., Ketterson J.B., and Hilliard J.E. Mechanical properties of composition modulated Cu-Ni foils. J. Appl. Phys. 57 (1985) 1076-1083
-
(1985)
J. Appl. Phys.
, vol.57
, pp. 1076-1083
-
-
Baral, D.1
Ketterson, J.B.2
Hilliard, J.E.3
-
3
-
-
0035342211
-
Indentation behavior and Young's modulus evaluation in electroless Ni modified CrN coating on mild steel
-
Chen J.S., and Duh J.G. Indentation behavior and Young's modulus evaluation in electroless Ni modified CrN coating on mild steel. Surf. Coat. Technol. 139 (2001) 6-13
-
(2001)
Surf. Coat. Technol.
, vol.139
, pp. 6-13
-
-
Chen, J.S.1
Duh, J.G.2
-
4
-
-
55249122118
-
Measurement of anisotropic fracture energies in periodic templated silica/polymer composite coatings
-
Chen, X., Richman, E.K., Kirsch, B.L., Senter, R., Tolbert, S.H., Gupta V., 2008. Measurement of anisotropic fracture energies in periodic templated silica/polymer composite coatings. J. Appl. Phys. 104, 083515.
-
(2008)
J. Appl. Phys
, vol.104
, pp. 083515
-
-
Chen, X.1
Richman, E.K.2
Kirsch, B.L.3
Senter, R.4
Tolbert, S.H.5
Gupta, V.6
-
6
-
-
36448999689
-
Fracture of metal-polymer line structures. I. Semiflexible polyimide
-
Chiu S.L., Leu J., and Ho S. Fracture of metal-polymer line structures. I. Semiflexible polyimide. J. Appl. Phys. 76 (1994) 5136-5142
-
(1994)
J. Appl. Phys.
, vol.76
, pp. 5136-5142
-
-
Chiu, S.L.1
Leu, J.2
Ho, S.3
-
7
-
-
0035369771
-
Self-assembled aerogel-like low dielectric constant films
-
Fan H., Bentley H.R., Kathan K.R., Clem P., Lu Y., and Brinker C.J. Self-assembled aerogel-like low dielectric constant films. J. Non-Cryst. Solids 285 (2001) 79
-
(2001)
J. Non-Cryst. Solids
, vol.285
, pp. 79
-
-
Fan, H.1
Bentley, H.R.2
Kathan, K.R.3
Clem, P.4
Lu, Y.5
Brinker, C.J.6
-
8
-
-
36549092777
-
Adhesion and deformation of metal/polyimide layered structures
-
Faupel F., Yang C.H., Chen S.T., and Ho P.S. Adhesion and deformation of metal/polyimide layered structures. J. Appl. Phys. 65 (1989) 1911-1917
-
(1989)
J. Appl. Phys.
, vol.65
, pp. 1911-1917
-
-
Faupel, F.1
Yang, C.H.2
Chen, S.T.3
Ho, P.S.4
-
9
-
-
84961757543
-
Nondestructive stiffness and density characterization of porous low-K films by surface acoustic wave spectroscopy
-
Flannery C.M., and Backlanov M.R. Nondestructive stiffness and density characterization of porous low-K films by surface acoustic wave spectroscopy. IEEE Proc. Int. Interconnect Technol. Conf. (2002) 233-235
-
(2002)
IEEE Proc. Int. Interconnect Technol. Conf.
, pp. 233-235
-
-
Flannery, C.M.1
Backlanov, M.R.2
-
10
-
-
0023646618
-
Mechanical properties and microstructures of Al-1%Si thin film metallizations
-
Griffin A.J., Brotzen F.R., and Dunn C.F. Mechanical properties and microstructures of Al-1%Si thin film metallizations. Thin Solid Films 150 (1987) 237-244
-
(1987)
Thin Solid Films
, vol.150
, pp. 237-244
-
-
Griffin, A.J.1
Brotzen, F.R.2
Dunn, C.F.3
-
11
-
-
0041792304
-
Adhesion and deformation study of metal/polymer structures by a stretch-deformation method
-
Ho P.S., and Faupel F. Adhesion and deformation study of metal/polymer structures by a stretch-deformation method. Appl. Phys. Lett. 53 (1988) 1602-1604
-
(1988)
Appl. Phys. Lett.
, vol.53
, pp. 1602-1604
-
-
Ho, P.S.1
Faupel, F.2
-
12
-
-
0006872192
-
Mechanical properties of non-mettallic thin films
-
Dupuy C.H.S., and Cachard A. (Eds), Plenum Press, New York
-
Hoffman R.W. Mechanical properties of non-mettallic thin films. In: Dupuy C.H.S., and Cachard A. (Eds). Physics of non-metallic thin films, Proceedings NATO Advanced Study Institutes Series, Series B: Physics Vol. 14 (1976), Plenum Press, New York 273-353
-
(1976)
Physics of non-metallic thin films, Proceedings NATO Advanced Study Institutes Series, Series B: Physics
, vol.14
, pp. 273-353
-
-
Hoffman, R.W.1
-
13
-
-
0032623850
-
A new method to study cyclic deformation of thin films in tension and compression
-
Hommel M., Kraft O., and Arzt E. A new method to study cyclic deformation of thin films in tension and compression. J. Mater. Res. 14 (1999) 2373-2376
-
(1999)
J. Mater. Res.
, vol.14
, pp. 2373-2376
-
-
Hommel, M.1
Kraft, O.2
Arzt, E.3
-
14
-
-
0034226704
-
Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
-
Huang H., and Spaepen F. Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers. Acta Mater. 48 (2000) 3261-3269
-
(2000)
Acta Mater.
, vol.48
, pp. 3261-3269
-
-
Huang, H.1
Spaepen, F.2
-
15
-
-
0031235416
-
Determination of Young's modulus by spherical indentation
-
Huber N., Munz D., and Tsakmakis Ch. Determination of Young's modulus by spherical indentation. J. Mater. Res. 12 9 (1997) 2459-2469
-
(1997)
J. Mater. Res.
, vol.12
, Issue.9
, pp. 2459-2469
-
-
Huber, N.1
Munz, D.2
Tsakmakis, Ch.3
-
16
-
-
0023533637
-
Elastic analysis of some punch problems for a layered medium
-
King R.B. Elastic analysis of some punch problems for a layered medium. Int. J. Solid Struct. 23 12 (1987) 1657-1664
-
(1987)
Int. J. Solid Struct.
, vol.23
, Issue.12
, pp. 1657-1664
-
-
King, R.B.1
-
17
-
-
0017964449
-
Mechanical properties of vacuum-deposited films: a commentary
-
Kinosita K. Mechanical properties of vacuum-deposited films: a commentary. Thin Solid Films 50 (1978) 205-210
-
(1978)
Thin Solid Films
, vol.50
, pp. 205-210
-
-
Kinosita, K.1
-
18
-
-
23744463879
-
Probing the effects of nanoscale architecture on the mechanical properties of hexagonal silica/polymer composite thin films
-
Kirsch B.L., Chen X., Richman E.K., Gupta V., and Tolbert S.H. Probing the effects of nanoscale architecture on the mechanical properties of hexagonal silica/polymer composite thin films. Adv. Func. Mater. 15 (2005) 1319-1327
-
(2005)
Adv. Func. Mater.
, vol.15
, pp. 1319-1327
-
-
Kirsch, B.L.1
Chen, X.2
Richman, E.K.3
Gupta, V.4
Tolbert, S.H.5
-
19
-
-
0001802796
-
Plastic deformation of thin copper films determined by X-ray microtensile tests
-
Kretschmann A., Kuschke W.M., Baker S.P., and Arzt E. Plastic deformation of thin copper films determined by X-ray microtensile tests. Mater. Res. Symp. Proc. 456 (1997) 59-64
-
(1997)
Mater. Res. Symp. Proc.
, vol.456
, pp. 59-64
-
-
Kretschmann, A.1
Kuschke, W.M.2
Baker, S.P.3
Arzt, E.4
-
20
-
-
0037012526
-
Evaluation of elastic modulus and yield strength of Al film using an electrostatically actuated test device
-
Lee S.H., Evans J.W., Pak Y.E., Jeon J.U., and Kwon D. Evaluation of elastic modulus and yield strength of Al film using an electrostatically actuated test device. Thin Solid Films 408 (2002) 223-229
-
(2002)
Thin Solid Films
, vol.408
, pp. 223-229
-
-
Lee, S.H.1
Evans, J.W.2
Pak, Y.E.3
Jeon, J.U.4
Kwon, D.5
-
21
-
-
0031621116
-
Stress-strain curves by tensile testing of thin metallic films on thin polyimide foils: Al, AlCu, CuNi(Mn)
-
Macionczyk F., Brucker W., and Reiss G. Stress-strain curves by tensile testing of thin metallic films on thin polyimide foils: Al, AlCu, CuNi(Mn). Mater. Res. Soc. Symp. Proc. 505 (1998) 235-240
-
(1998)
Mater. Res. Soc. Symp. Proc.
, vol.505
, pp. 235-240
-
-
Macionczyk, F.1
Brucker, W.2
Reiss, G.3
-
22
-
-
0036897565
-
Determination of Young's modulus of porous low-k films by Ellipsometric Porosimetry
-
Mogilnikov K.P., and Baklanov M.R. Determination of Young's modulus of porous low-k films by Ellipsometric Porosimetry. Electrochem. Solid-State Lett. 5 12 (2002) F29-F31
-
(2002)
Electrochem. Solid-State Lett.
, vol.5
, Issue.12
-
-
Mogilnikov, K.P.1
Baklanov, M.R.2
-
23
-
-
0031639571
-
On the influence of titanium alloy composition and layer thickness on the mechanical properties of a polyimide substrate
-
Muralidharan, G., Narayanan, B., Wong, C.C., Manoharan, M., 1998. On the influence of titanium alloy composition and layer thickness on the mechanical properties of a polyimide substrate. Mater. Res. Soc. Symp. Proc. 515, 203-208.
-
(1998)
Mater. Res. Soc. Symp. Proc
, vol.515
, pp. 203-208
-
-
Muralidharan, G.1
Narayanan, B.2
Wong, C.C.3
Manoharan, M.4
-
24
-
-
0037039185
-
Effects of the substrate on the determination of thin film mechanical properties by nanoindentation
-
Saha R., and Nix W.D. Effects of the substrate on the determination of thin film mechanical properties by nanoindentation. Acta Mater. 50 (2002) 23-28
-
(2002)
Acta Mater.
, vol.50
, pp. 23-28
-
-
Saha, R.1
Nix, W.D.2
-
26
-
-
0032050141
-
Young's modulus of thin flms by speckle interferometry
-
Read D.T. Young's modulus of thin flms by speckle interferometry. Meas. Sci. Technol. 9 (1998) 676-685
-
(1998)
Meas. Sci. Technol.
, vol.9
, pp. 676-685
-
-
Read, D.T.1
-
27
-
-
0037474494
-
Damage mode tensile testing of thin gold films on polyimide substrates by X-ray diffraction and atomic force microscopy
-
Renault P.O., Villain P., Coupeau C., Goudeau P., and Badawi K.F. Damage mode tensile testing of thin gold films on polyimide substrates by X-ray diffraction and atomic force microscopy. Thin Solid Films 424 (2003) 267-273
-
(2003)
Thin Solid Films
, vol.424
, pp. 267-273
-
-
Renault, P.O.1
Villain, P.2
Coupeau, C.3
Goudeau, P.4
Badawi, K.F.5
-
29
-
-
0027270622
-
A new method for tensile testing of thin films
-
Ruud J.A., Josell D., Spaepen F., and Greer A.A. A new method for tensile testing of thin films. J. Mater. Res. 8 1 (1993) 112-117
-
(1993)
J. Mater. Res.
, vol.8
, Issue.1
, pp. 112-117
-
-
Ruud, J.A.1
Josell, D.2
Spaepen, F.3
Greer, A.A.4
-
31
-
-
0020132839
-
Applications of the interferometric strain/displacement gage
-
Sharpe Jr. W.N. Applications of the interferometric strain/displacement gage. Opt. Eng. 21 (1982) 483-488
-
(1982)
Opt. Eng.
, vol.21
, pp. 483-488
-
-
Sharpe Jr., W.N.1
-
32
-
-
0037771131
-
Film-thickness considerations in microcantilever-beam test in measuring mechanical properties of metal thin film
-
Son D., Jeong J.H., and Kwon D. Film-thickness considerations in microcantilever-beam test in measuring mechanical properties of metal thin film. Thin Solid Films 437 (2003) 182-187
-
(2003)
Thin Solid Films
, vol.437
, pp. 182-187
-
-
Son, D.1
Jeong, J.H.2
Kwon, D.3
-
33
-
-
0032295384
-
Tensile testing of ultra-thin-film materials deposited on polyimide for MEMS applications
-
Tregilgas J.H., and Strumpell M. Tensile testing of ultra-thin-film materials deposited on polyimide for MEMS applications. Mater. Res. Soc. Symp. Proc. 518 (1998) 179-184
-
(1998)
Mater. Res. Soc. Symp. Proc.
, vol.518
, pp. 179-184
-
-
Tregilgas, J.H.1
Strumpell, M.2
-
34
-
-
0033438070
-
The search for novel, superhard materials
-
Veprek S. The search for novel, superhard materials. Vac. Sci. Technol. A: Vacuum, Surfaces, and Films 17 5 (1999) 2401-2420
-
(1999)
Vac. Sci. Technol. A: Vacuum, Surfaces, and Films
, vol.17
, Issue.5
, pp. 2401-2420
-
-
Veprek, S.1
-
35
-
-
0036504729
-
Towards the understanding of mechanical properties of super and ultrahard nanocomposites
-
Veprek S., and Argon A.S. Towards the understanding of mechanical properties of super and ultrahard nanocomposites. J. Vac. Sci. Technol. B20 2 (2002) 650-664
-
(2002)
J. Vac. Sci. Technol.
, vol.B20
, Issue.2
, pp. 650-664
-
-
Veprek, S.1
Argon, A.S.2
-
36
-
-
1842584184
-
The yield strength of thin copper films on Kapton
-
Yu D.Y.W., and Spaepen F. The yield strength of thin copper films on Kapton. J. Appl. Phys. 95 6 (2004) 2991-2997
-
(2004)
J. Appl. Phys.
, vol.95
, Issue.6
, pp. 2991-2997
-
-
Yu, D.Y.W.1
Spaepen, F.2
|