Evaluation of elastic modulus and yield strength of Al film using an electrostatically actuated test device

Thin Solid Films

Volumn 408, Issue 1-2, 2002, Pages 223-229

  Lee, Se Ho ^a   Evans, John W ^a   Pak, Y Eugene ^b   Jeon, Jong Up ^b   Kwon, Dongil ^a  

^a Seoul National University   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Aluminum; Elastic properties; Electrostatic test device; Microelectromechanical system

Indexed keywords

ALUMINUM; ELASTIC MODULI; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; THIN FILMS; YIELD STRESS;

ELECTROSTATIC TEST DEVICES;

METALLIC FILMS;

EID: 0037012526     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00067-6     Document Type: Article

References (14)