Damage mode tensile testing of thin gold films on polyimide substrates by X-ray diffraction and atomic force microscopy

Thin Solid Films

Volumn 424, Issue 2, 2003, Pages 267-273

  Renault, P O ^a   Villain, P ^a   Coupeau, C ^a   Goudeau, P ^a   Badawi, K F ^a  

^a UNIVERSITÉ DE POITIERS   (France)

Author keywords

Atomic force microscopy; Buckling; Gold; Thin films; X ray diffraction

Indexed keywords

ATOMIC FORCE MICROSCOPY; BUCKLING; COMPRESSIVE STRESS; CRACK INITIATION; DELAMINATION; GOLD; POLYIMIDES; TENSILE TESTING; X RAY DIFFRACTION ANALYSIS;

TENSILE DEFORMATION;

THIN FILMS;

EID: 0037474494     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)01127-6     Document Type: Article

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