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Volumn 505, Issue , 1998, Pages 235-240
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Stress-strain curves by tensile testing of thin metallic films on thin polyimide foils: Al, AlCu, CuNi(Mn)
a
a
IFW DRESDEN
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
ALUMINUM COPPER ALLOYS;
METAL FOIL;
NICKEL ALLOYS;
POLYIMIDES;
STRAIN;
STRESSES;
TENSILE TESTING;
THERMAL EFFECTS;
THIN FILMS;
X RAY DIFFRACTION ANALYSIS;
THIN POLYIMIDE FOILS;
METALLIC FILMS;
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EID: 0031621116
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (9)
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References (7)
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