Effect of residual stresses on mechanical properties and interface adhesion strength of SiN thin films

Thin Solid Films

Volumn 517, Issue 17, 2009, Pages 4857-4861

  Huang, Yi Chung ^a   Chang, Shou Yi ^a   Chang, Chih Hsiang ^b  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Interface adhesion; Mechanical property; Residual stress

Indexed keywords

BLUNT CRACK; CRACK OPENING; HARDNESS AND ELASTIC MODULUS; INTERFACE ADHESION; INTERFACE ADHESION ENERGY; MECHANICAL RELIABILITY; NANOINDENTATION TESTS; NANOSCRATCH TEST; PENETRATION DEPTH;

ADHESION; BOND STRENGTH (MATERIALS); COMPRESSIVE STRESS; CRACK PROPAGATION; CRACK TIPS; MECHANICAL PROPERTIES; NANOINDENTATION; RESIDUAL STRESSES; SILICON NITRIDE; STRESS INTENSITY FACTORS; THIN FILMS;

TENSILE STRESS;

EID: 65649101946     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.03.043     Document Type: Article

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