-
1
-
-
0242552155
-
Recent advances on electromigration in very-large-scale-integration of interconnects
-
Tu K N 2003 Recent advances on electromigration in very-large-scale- integration of interconnects J. Appl. Phys. 94 5451-73
-
(2003)
J. Appl. Phys.
, vol.94
, Issue.9
, pp. 5451-5473
-
-
Tu, K.N.1
-
2
-
-
79956017414
-
Reduced electromigration of Cu wires by surface coating
-
Hu C K, Gignac L, Rosenberg R, Liniger E, Rubino J, Sambucetti C, Domenicucci A, Chen X and Stamper A K 2002 Reduced electromigration of Cu wires by surface coating Appl. Phys. Lett. 81 1782-4
-
(2002)
Appl. Phys. Lett.
, vol.81
, Issue.10
, pp. 1782-1784
-
-
Hu, C.K.1
Gignac, L.2
Rosenberg, R.3
Liniger, E.4
Rubino, J.5
Sambucetti, C.6
Domenicucci, A.7
Chen, X.8
Stamper, A.K.9
-
3
-
-
0035898726
-
AES analysis of failures in Cu based electromigration test samples
-
Baunack S, Kotter T G, Wendrock H and Wetzig K 2001 AES analysis of failures in Cu based electromigration test samples Appl. Surf. Sci. 179 245-50
-
(2001)
Appl. Surf. Sci.
, vol.179
, Issue.1-4
, pp. 245-250
-
-
Baunack, S.1
Kotter, T.G.2
Wendrock, H.3
Wetzig, K.4
-
4
-
-
34249035246
-
Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy
-
Kuan-Chia C, Chien-Neng L, Wen-Wei W and Lih-Juann C 2007 Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy Appl. Phys. Lett. 90 203101
-
(2007)
Appl. Phys. Lett.
, vol.90
, Issue.20
, pp. 203101
-
-
Kuan-Chia, C.1
Chien-Neng, L.2
Wen-Wei, W.3
Lih-Juann, C.4
-
5
-
-
0036776502
-
In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures
-
Meyer M A, Herrmann M, Langer E and Zschech E 2002 In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures Microelectron. Eng. 64 375-82
-
(2002)
Microelectron. Eng.
, vol.64
, Issue.1-4
, pp. 375-382
-
-
Meyer, M.A.1
Herrmann, M.2
Langer, E.3
Zschech, E.4
-
6
-
-
0344942481
-
Electrical characterization of electrochemically grown single copper nanowires
-
Molares M E T, Hohberger E M, Schaeflein C, Blick R H, Neumann R and Trautmann C 2003 Electrical characterization of electrochemically grown single copper nanowires Appl. Phys. Lett. 82 2139-41
-
(2003)
Appl. Phys. Lett.
, vol.82
, Issue.13
, pp. 2139-2141
-
-
Molares, M.E.T.1
Hohberger, E.M.2
Schaeflein, C.3
Blick, R.H.4
Neumann, R.5
Trautmann, C.6
-
7
-
-
33751082357
-
Surface contamination effects on resistance of gold nanowires
-
Lilley C M and Huang Q 2006 Surface contamination effects on resistance of gold nanowires Appl. Phys. Lett. 89 203114
-
(2006)
Appl. Phys. Lett.
, vol.89
, Issue.20
, pp. 203114
-
-
Lilley, C.M.1
And Huang, Q.2
-
8
-
-
0032624766
-
Scanning Auger microscopy study of electromigration induced failure in submicrometric microelectronic devices
-
Santucci S, Lozzi L, Pacifico D, Alfonsetti R and Moccia G 1999 Scanning Auger microscopy study of electromigration induced failure in submicrometric microelectronic devices Appl. Surf. Sci. 145 329-33
-
(1999)
Appl. Surf. Sci.
, vol.145
, pp. 329-333
-
-
Santucci, S.1
Lozzi, L.2
Pacifico, D.3
Alfonsetti, R.4
Moccia, G.5
-
9
-
-
33747307274
-
Electromigration in damascene copper interconnects of line width down to 100 nm
-
DOI 10.1088/0268-1242/21/9/026, PII S0268124206227871, 026
-
Roy A, Kumar R, Tan C M, Wong T K S and Tung C H 2006 Electromigration in damascene copper interconnects of line width down to 100 nm Semicond. Sci. Technol. 21 1369-72 (Pubitemid 44235585)
-
(2006)
Semiconductor Science and Technology
, vol.21
, Issue.9
, pp. 1369-1372
-
-
Roy, A.1
Kumar, R.2
Tan, C.M.3
Wong, T.K.S.4
Tung, C.-H.5
-
11
-
-
0032615341
-
Analysis of failure mechanisms in electrically stressed Au nanowires
-
Durkan C, Schneider M A and Welland M E 1999 Analysis of failure mechanisms in electrically stressed Au nanowires J. Appl. Phys. 86 1280-6 (Pubitemid 129307304)
-
(1999)
Journal of Applied Physics
, vol.86
, Issue.3
, pp. 1280-1286
-
-
Durkan, C.1
Schneider, M.A.2
Welland, M.E.3
-
12
-
-
48849114208
-
Surface and size effects on the electrical properties of Cu nanowires
-
Huang Q, Lilley C M, Bode M and Divan R 2008 Surface and size effects on the electrical properties of Cu nanowires J. Appl. Phys. 104 023709
-
(2008)
J. Appl. Phys.
, vol.104
, pp. 023709
-
-
Huang, Q.1
Lilley, C.M.2
Bode, M.3
Divan, R.4
-
13
-
-
12244299190
-
Biased resistor network model for electromigration failure and related phenomena in metallic lines
-
Pennetta C, Alfinito E, Reggiani L, Fantini F, DeMunari I and Scorzoni A 2004 Biased resistor network model for electromigration failure and related phenomena in metallic lines Phys. Rev. B 70 174305
-
(2004)
Phys. Rev.
, vol.70
, Issue.17
, pp. 174305
-
-
Pennetta, C.1
Alfinito, E.2
Reggiani, L.3
Fantini, F.4
Demunari, I.5
Scorzoni, A.6
-
14
-
-
0034245030
-
In situ observation of electromigration in micrometre-sized gold stripes by scanning force microscopy
-
de Pablo P J, Asenjo A, Colchero J, Serena P A, Gomez-Herrero J and Baro A M 2000 In situ observation of electromigration in micrometre-sized gold stripes by scanning force microscopy Surf. Interface Anal. 30 278-82
-
(2000)
Surf. Interface Anal.
, vol.30
, Issue.1
, pp. 278-282
-
-
De Pablo, P.J.1
Asenjo, A.2
Colchero, J.3
Serena, P.A.4
Gomez-Herrero, J.5
Baro, A.M.6
-
15
-
-
25944438622
-
Electrical-resistivity model for polycrystalline films: The case of arbitrary reflection at external surfaces
-
Mayadas A F and Shatzkes M 1970 Electrical-resistivity model for polycrystalline films: the case of arbitrary reflection at external surfaces Phys. Rev. B 1 1382
-
(1970)
Phys. Rev.
, vol.1
, Issue.4
, pp. 1382
-
-
Mayadas, A.F.1
And Shatzkes, M.2
-
16
-
-
1842617942
-
Electromigration in metals
-
Ho P S and Kwok T 1989 Electromigration in metals Rep. Prog. Phys. 52 301-48
-
(1989)
Rep. Prog. Phys.
, vol.52
, Issue.3
, pp. 301-348
-
-
Ho, P.S.1
And Kwok, T.2
-
17
-
-
0037252548
-
Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects
-
Arnaud L, Berger T and Reimbold G 2003 Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects J. Appl. Phys. 93 192-204
-
(2003)
J. Appl. Phys.
, vol.93
, Issue.1
, pp. 192-204
-
-
Arnaud, L.1
Berger, T.2
Reimbold, G.3
-
18
-
-
0001051241
-
Barrier behaviour of plasma deposited silicon oxide and nitride against Cu diffusion
-
Vogt M and Drescher K 1995 Barrier behaviour of plasma deposited silicon oxide and nitride against Cu diffusion Appl. Surf. Sci. 91 303
-
(1995)
Appl. Surf. Sci.
, vol.91
, pp. 303
-
-
Vogt, M.1
And Drescher, K.2
-
20
-
-
84937650904
-
Electromigration-a brief survey and some recent results
-
Black J R 1969 Electromigration-a brief survey and some recent results IEEE Trans. Electron Devices 16 338
-
(1969)
IEEE Trans. Electron Devices
, vol.16
, pp. 338
-
-
Black, J.R.1
-
21
-
-
34548673315
-
Black's law revisited-Nucleation and growth in electromigration failure
-
DOI 10.1016/j.microrel.2007.07.094, PII S0026271407003630
-
Lloyd J R 2007 Black's law revisited-nucleation and growth in electromigration failure Microelectron. Reliab. 47 1468-72 (Pubitemid 47418083)
-
(2007)
Microelectronics Reliability
, vol.47
, Issue.9-11
, pp. 1468-1472
-
-
Lloyd, J.R.1
-
22
-
-
0031245670
-
Electromigration in 0.25 μm wide Cu line on W
-
PII S0040609097004872
-
Hu C K, Lee K Y, Gignac L and Carruthers R 1997 Electromigration in 0.25 νm wide Cu line on W Thin Solid Films 308/309 443 (Pubitemid 127432299)
-
(1997)
Thin Solid Films
, vol.308-309
, Issue.1-4
, pp. 443-447
-
-
Hu, C.-K.1
Lee, K.Y.2
Gignac, L.3
Carruthers, R.4
-
23
-
-
33645682367
-
Low temperature melting of copper nanorod arrays
-
Karabacak T, DeLuca J S, Wang P I, Ten Eyck G A, Ye D, Wang G C and Lu T M 2006 Low temperature melting of copper nanorod arrays J. Appl. Phys. 99 064304
-
(2006)
J. Appl. Phys.
, vol.99
, pp. 064304
-
-
Karabacak, T.1
Deluca, J.S.2
Wang, P.I.3
Ten Eyck, G.A.4
Ye, D.5
Wang, G.C.6
Lu, T.M.7
-
24
-
-
9744228083
-
Light emission from gold and silver thin films in a scanning tunneling microscope: Role of contamination and interpretation of grain structure in photon maps
-
Walmsley D G, Tan T S and Dawson P 2004 Light emission from gold and silver thin films in a scanning tunneling microscope: role of contamination and interpretation of grain structure in photon maps Surf. Sci. 572 497-520
-
(2004)
Surf. Sci.
, vol.572
, Issue.2-3
, pp. 497-520
-
-
Walmsley, D.G.1
Tan, T.S.2
Dawson, P.3
|