Surface and size effects on the electrical properties of Cu nanowires

Journal of Applied Physics

Volumn 104, Issue 2, 2008, Pages

  Huang, Qiaojian ^a   Lilley, Carmen M ^a   Bode, Matthias ^b   Divan, Ralu ^b  

^a 1120 Science and Engineering Offices   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; COPPER ALLOYS; CURRENT DENSITY; ELECTRIC PROPERTIES; ELECTRIC WIRE; ELECTRON BEAM LITHOGRAPHY; FINITE ELEMENT METHOD; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; OPTICAL DESIGN;

COPPER FILMS; COPPER NANOWIRES; CU NANOWIRES; DEPENDENT FAILURE; E-BEAM EVAPORATIONS; E-BEAM LITHOGRAPHY; ELECTRICAL PROPERTIES; FINITE-ELEMENT METHODS; HEAT-TRANSFER; SIZE EFFECTS; SUBSTRATE SYSTEM; TEMPERATURE COEFFICIENT OF RESISTANCE; WIRE WIDTH;

NANOWIRES;

EID: 48849114208     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2956703     Document Type: Article

References (27)

1. A. Husain, J. Hone, H. W. C. Postma, X. M. H. Huang, T. Drake, M. Barbic, A. Scherer, and M. L. Roukes, Appl. Phys. Lett. 83, 1240 (2003).
2. K. Kim, S. J. Yoon, and D. Kim, Opt. Express 14, 12419 (2006).
3. E. C. Walter, R. M. Penner, H. Liu, K. H. Ng, M. P. Zach, and F. Favier, Surf. Interface Anal. 34, 409 (2002).
4. A. Bid, A. Bora, and A. K. Raychaudhuri, Phys. Rev. B 74, 035426 (2006).
5. S. Maitrejean, R. Gers, T. Mourier, A. Toffoli, and G. Passemard, Microelectron. Eng. 83, 2396 (2006).
6. W. Steinhogl, G. Schindler, G. Steinlesberger, and M. Engelhardt, Phys. Rev. B 66, 075414 (2002).
7. G. Schindler, G. Steinlesberger, M. Engelhardt, and W. Steinhogl, Solid-State Electron. 47, 1233 (2003).
8. W. Steinhoegl, G. Schindler, G. Steinlesberger, M. Traving, and M. Engelhardt, International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003 (unpublished), pp. 27-30.
9. C. Durkan and M. E. Welland, Ultramicroscopy 82, 125 (2000).
10. P. Rai-Choudhury, Handbook of Microlithography, Micromachining, and Microfabrication, Vol 1: Microlithography (SPIE, Bellingham, WA, 1997).
11. J. A. Wiebelt, Engineering Radiation Heat Transfer (Holt, Rinehart and Winston, New York, 1966).
12. K. Fuchs, Proc. Cambridge Philos. Soc. 34, 100 (1938).
13. E. H. Sondheimer, Adv. Phys. 1, 1 (1952).
14. A. F. Mayadas and M. Shatzkes, Phys. Rev. B 1, 1382 (1970).
15. D. R. Lide, Handbook of Chemistry and Physics (CRC, New York, 2005).
16. E. J. Menke, M. A. Thompson, C. Xiang, L. C. Yang, and R. M. Penner, Nat. Mater. 5, 914 (2006).
17. A. Kwatera and A. Sawka, J. Non-Cryst. Solids 265, 120 (2000).
18. B. Stahlmecke and G. Dumpich, Appl. Phys. Lett. 90, 043517 (2007).
19. F. Warkusz, J. Phys. D: Appl. Phys. 11, 689 (1978).
20. B. S. Verma and S. K. Sharma, Thin Solid Films 5, R44 (1970).
21. R. W. Berry, P. M. Hall, and M. T. Harris, Thin Film Technology (D. Van Nostrand, Princeton, NJ, 1968).
22. P. M. Hall, Appl. Phys. Lett. 12, 212 (1968).
23. J. B. Thompson, Thin Solid Films 18, 77 (1973).
24. W. Lang, IEEE Trans. Electron Devices 37, 958 (1990).
25. N. Sabate, J. Santander, I. Gracia, L. Fonseca, E. Figueras, E. Cabruja, and C. Cane, Thin Solid Films 484, 328 (2005).
26. Y. S. Touloukian and C. Y. Ho, Thermophysical Properties of Matter, the TPRC Data Series, Thermal Conductivity of Nanmetallic Solids (IFI/Plenum, New York, 1970).
27. T. Karabacak, J. S. DeLuca, P. I. Wang, G. A. Ten Eyck, D. Ye, G. C. Wang, and T. M. Lu, J. Appl. Phys. 99, 064304 (2006).