Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy

Applied Physics Letters

Volumn 90, Issue 20, 2007, Pages

  Chen, Kuan Chia ^a   Liao, Chien Neng ^a   Wu, Wen Wei ^a   Chen, Lih Juann ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL ORIENTATION; ELECTROMIGRATION; PASSIVATION; SURFACE STRUCTURE; TRANSMISSION ELECTRON MICROSCOPY; ULTRAHIGH VACUUM;

ATOMIC MIGRATION; COPPER LINES; SURFACE ATOMIC STEPS;

SURFACE ANALYSIS;

EID: 34249035246     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2740109     Document Type: Article

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