A wafer-scale encapsulated RF MEMS switch with a stress-reduced corrugated diaphragm

Sensors and Actuators, A: Physical

Volumn 151, Issue 2, 2009, Pages 237-243

  Ke, Feixiang ^a   Miao, Jianmin ^a   Wang, Zhihong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Corrugated diaphragm; Residual stress; RF MEMS switch; Wafer scale encapsulation

Indexed keywords

ANALYTICAL EQUATIONS; CORRUGATED DIAPHRAGM; EQUIVALENT STRESS; MEMS SWITCHES; PULL-IN VOLTAGES; RF MEMS SWITCH; RF PERFORMANCE; SIGNAL CURRENTS; STRESS CONTROLS; SWITCHING CYCLES; THIN-FILM DEPOSITIONS; WAFER-SCALE ENCAPSULATION;

ELECTRIC SWITCHES; FABRICATION; MEMS; MICROELECTROMECHANICAL DEVICES; RESIDUAL STRESSES; STRENGTH OF MATERIALS;

DIAPHRAGMS;

EID: 64549158797     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.02.031     Document Type: Article

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