Modeling of multiple scattering among vias in planar waveguides using Foldy - Lax equations

Microwave and Optical Technology Letters

Volumn 31, Issue 3, 2001, Pages 201-208

  Tsang, Leung ^a   Chen, Houfei ^a   Huang, Chung Chi ^a   Jandhyala, Vikram ^a  

^a University of Washington   (United States)

Author keywords

Foldy Lax equation; Multiple scattering; Vector cylindrical waves; Vias

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC WAVE SCATTERING; GREEN'S FUNCTION; MATHEMATICAL MODELS; MATRIX ALGEBRA; VECTORS;

PLANAR WAVEGUIDES;

WAVEGUIDES;

EID: 0035813539     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.1398     Document Type: Article

References (10)

1. Quasi-static analysis of a microstrip via through a hole in a ground plane
2. Full wave characterization of a through hole via using the matrix-penciled moment method
3. Full-wave characterization of a through hole via in multi-layered packaging
4. Modeling and analysis of vias in multilayered integrated circuits
5. Coupled noise analysis for adjacent vias in multilayered digital circuits
6. The admittance of cylindrical antennas driven from a coaxial line