Modeling of multilayered packages and boards using modal decomposition and finite difference methods

IEEE International Symposium on Electromagnetic Compatibility

Volumn 3, Issue , 2006, Pages 646-650

  Engin, A Ege ^a   Bharath, Krishna ^a   Srinivasan, Krishna ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC LINES; FINITE DIFFERENCE METHOD; PROBLEM SOLVING;

MODAL DECOMPOSITION; SIGNAL INTEGRITY (SI); SIMULTANEOUS SWITCHING NOISE (SSN);

MULTILAYER NEURAL NETWORKS;

EID: 34047209903     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/isemc.2006.1706390     Document Type: Conference Paper

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