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Scripta Materialia

Volumn 60, Issue 12, 2009, Pages 1121-1124

The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

(2) Chiu, Tsung Chieh a Lin, Kwang Lung a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

Dislocation; Electromigration; Intermetallic compounds; Transmission electron microscopy (TEM); Whiskers

Indexed keywords

BRAZING; CRYSTAL WHISKERS; DIFFRACTION; ELECTROMIGRATION; ELECTRON MICROSCOPES; ELECTRONS; HOLOGRAPHIC INTERFEROMETRY; ROTATION; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; STRESSES; TRANSMISSION ELECTRON MICROSCOPY; WELDING;

DISLOCATION; ELECTRON DIFFRACTION PATTERNS; INTERMETALLIC COMPOUNDS; MECHANICAL STRESS; MICROSTRUCTURAL INVESTIGATIONS; SN WHISKERS; SOLDER JOINTS; WHISKER GROWTHS; WHISKERS;

TIN;

EID: 63649112761 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2009.02.061 Document Type: Article

Times cited : (31)

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