Investigation of gray-scale technology for large area 3D silicon MEMS structures

Journal of Micromechanics and Microengineering

Volumn 13, Issue 2, 2003, Pages 170-177

  Waits, Christopher M ^a   Modafe, Alireza ^a   Ghodssi, Reza ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; LITHOGRAPHY; PHOTORESISTS; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

GRAY-SCALE LITHOGRAPHY;

MICROELECTROMECHANICAL DEVICES;

EID: 0037340912     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/2/302     Document Type: Article

References (19)

1. Oehrlein G S and Rembetski J F 1992 Plasma-based dry etching techniques in the silicon integrated circuit technology IBM J. Res. Dev. 36 140-57
2. Shikida M, Tokoro K, Uchikawa D and Sato K 2000 Surface morphology of anisotropically etched single-crystal silicon J. Micromech. Microeng. 10 522-7
3. Senturia S D 2001 Microsystem Design (Boston: Kluwer)
4. Epstein A H et al 1997 Power MEMS and microengines IEEE Int. Conf. on Solid-State Sensors and Actuators (Transducers 1997) vol 2 pp 753-6
5. Frechette L G, Nagle S F, Ghodssi R, Umans S D, Schmidt M A and Lang J H 2001 14th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2001) pp 290-3
6. Bourouina T, Masuzawa T and Fujita H 2001 The MEMSNAS process: microloading effect for micromachining of 3D structures with nearly arbitrary shape IEEE/LEOS Optical MEMS 2001 pp 25-8
7. Chou T-K A and Najafi K 2002 Fabrication of out-of-plane curved surfaces in Si by utilizing RIE 1ag IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2002) pp 145-8
8. Ayón A A, Nagle S, Frechette L, Epstein A and Schmidt M A 2000 Tailoring etch directionality in a deep reactive ion etching tool J. Vac. Sci. Technol. 18 1412-6
9. Beuret C, Racine G-A, Gobet J, Luthier R and de Rooij N F 1994 Microfabrication of 3D multidirectional inclined structures by UV lithography and electroplating Proc. IEEE Int. Conf. on Micro Electro Mechanical Syst. (MEMS 1994) pp 81-5
10. Bertsch A, Lorenz H and Renaud P 1998 Combining microstereolithography and thick resist UV lithography for 3D microfabrication IEEE 11th Annual Int. Workshop on Micro Electro Mechanical Systems (MEMS 1998) pp 18-23
11. Gal 1994 US Patent 5,310,623
12. Henke W, Hoppe W, Quenzer H J, Staudt-Fischbach P and Wagner B 1994 Simulation and experimental study of gray-tone lithography for the fabrication of arbitrarily shaped surfaces Proc. IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 1994) pp 205-10
13. Suleski T J and O'Shea D C 1995 Gray-scale masks for diffractive-optics fabrication: I. Commercial slide imagers Appl. Opt. 34 7507-17
14. O'Shea D C 1995 Gray-scale masks for diffractive-optics fabrication: II. Spatially filtered halftone screens Appl. Opt. 34 7518-26
15. LeCompte M, Gao X and Prather W 2001 Photoresist characterization and linearization procedure for the gray-scale fabrication of diffractive optical elements Appl. Opt. 40 5921-7
16. Whitley M R, Clark R L, Shaw J R, Brown D R, Erbach P S and Dorek G T 2002 International Patent WO 02/31600 A1
17. Daschner W, Stein R, Long Pin, Wu Chuck and Lee S H 1996 One-step lithography for mass production of multilevel diffractive optical elements using high energy beam sensitive (HEBS) gray-level mask Proc. SPIE: Diffractive and Holographic Optics Technology III vol 2689 pp 153-5
18. Sheats J R and Smith B W 1998 Microlithography Science and Technology (New York: Dekker)
19. Waits C M, Ghodssi R, Ervin M H and Dubey M 2001 MEMS-based gray-scale lithography Int. Semiconductor Device Research Symp. (ISDRS 01') pp 182-5