Coarsening in BGA solder balls: Modeling and experimental evaluation

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 426-430

  Basaran, Cemal ^a   Wen, Yujun ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CONTINUUM MECHANICS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; THERMODYNAMIC PROPERTIES;

BALL GRID ARRAY; MICROSTRUCTURAL COARSENING; PHASE GROWTH; THERMAL FATIGUE; THERMOMECHANICAL FATIGUE FAILURE;

SOLDERED JOINTS;

EID: 0141953078     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1602707     Document Type: Article

References (43)

1. Solomon, H. D., 1986, Brazing and Soldering, 11, pp. 68-75.
2. Solomon, H. D., and Tolksdorf, E. D., 1995, J. Electron. Packag., 117, pp. 130-135.
3. Dasgupta, A., and Hu, J. M., 1992, IEEE Trans. Reliab., 41, pp. 489-495.
4. Wei, Y., and Chow, C. L., 2001, Int. J. Damage Mech., 10, pp. 133-152.
5. Guo, Q., Cutiongco, E. C., Keer, L. M., and Fine, M. E., 1992, J. Electron. Packag., 114, pp. 145-151.
6. Busso, E. P., Kitano, M., and Kumazawa, T., 1994, J. Electron. Packag., 116, pp. 6-15.
7. Lau, J. H., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York.
8. McDowell, D. L., Miller, M. P., and Brooks, D. C., 1994, "Fatigue of Electronic Materials," ASTM Spec. Tech. Publ., 1153, pp. 42-59.
9. Basaran, C., and Chandaroy, R., 1997, IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, pp. 530-536.
10. Basaran, C., and Chandaroy, R., 1998, J. Appl. Math. Modeling, 22, pp. 601-627.
11. Basaran, C., and Chandaroy, R., 1999, ASME J. Electron. Packag., 121, pp. 8-12.
12. Basaran, C., and Chandaroy, R., 1999 ASME J. Electron. Packag., 121, pp. 12-17.
13. Basaran, C., and Yan, C. Y., 1998, ASME J. Electron. Packag., 120, pp. 379-384.
14. Basaran, C., Desai, C. S., and Kundu, T., 1998, ASME J. Electron. Packag., 120, pp. 41-47.
15. Chandroy, R., and Basaran, C., 1999, ASME J. Electron. Packag., 121, pp. 61-68.
16. Basaran, C., and Tang, H., 2001. "Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints," Int. J. Damage Mech. 10(3), pp 235-255.
17. Basaran, C., Tang, H., Dishongh, T., and Searls, D., 2001, Advanced Packaging, 1, pp. 17-22.
18. Basaran, C., Cartwright, A., and Zhao, Y., 2001, Int. J. Damage Mech., 10, pp. 153-170.
19. Morris, Jr., J. W., Tribula, D., Summers, T. S. E., and Grivas D., 1991, "The Role of Microstructure in Thermal Fatigue of Pb/Sn Solder Joints," in Solder Joint Reliability, J. H. Lau et al., eds. Van Nostrand Reinhold, New York, pp. 225-265.
20. Frear, D. R., Burchett, S. N., and Neilsen, M. K., 1997. Adv. Electron. Packag., E. Suhir et al., EEP-19-12, pp. 1515-1522.
21. Li, L., and Muller, W. H., 2001. Comput. Mater. Sci., 21, pp. 159-184.
22. Bangs, E. R. and Beal, R. E., 1978, Wel. J. Res. Supp., 54, p. 377.
23. Frear, D. R., and Morris, D., 1988, J. Met., 40, pp.18-22.
24. Wolverton, A., 1987, Brazing and Soldering, 13, p. 33.
25. Tribula, D. G., Grivas, D., Frear, D., and Morris, J., 1989, J. Electron. Packag., 111, pp. 83-89.
26. Kashyap, B. P., and Murty, G. S., 1982, Metall. Trans. A, 13, pp. 53-59.
27. Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T., 1999, J. Mech. Behav. Mater. 10, pp. 135-146.
28. Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T., 2000, Mech. Mater., 32, pp. 161-173.
29. Callister, Jr., W., 1985, Materials Science and Engineering: An Introduction, Wiley, New York.
30. Speight, M. V., 1968, Acta Metall., 16, pp. 133-135.
31. Ardell, A. J., 1972, Acta Metall., 20, pp. 61-71.
32. Ardell, A. J., 1972, Acta Metall., 20, pp. 601-609.
33. Senkov, O. N., and Myshlyaev, M. M., 1986, Acta Metall., 34, pp. 97-106.
34. Sayama, T., Takayanagi, T., and Mori, T., 1999, Advances in Electronic Packaging, EEP-26-1.
35. Clark, M. A., and Alden, T. H., 1973, Acta Metall., 21, p. 1195.
36. Lifshitz, I. M., and Slyozov, V. V., 1961, J. Phys. Chem. Solids, 19, p. 35.
37. Hillert, M., 1965, Acta Metall., 13, pp. 227-238.
38. Martin, J. W., and Doherty, R. D., 1976, Stability of Microstructure in Metallic Systems, Cambridge University Press, Cambridge, U.K.
39. Hacke, P. L., Sprecher, A. F., and Conrad, H., 1993, ASME J. Electron. Packag., 115, pp. 153-164.
40. Arrowood, R., Mukherjee, A., and Jones, W., 1991, "Hot Deformation of Two-Phase Mixtures," Chap. 3 in Solder Mechanics: A State of the Art Assessment, Frear, D., Jones, W. B., and Kinsman, K. (eds.), TMS, Minerals, Metals & Materials Society, Warrendale, PA.
41. Nabarro, F. R. N., 1998, Scr. Mater., 39, pp. 1681-1683.
42. Upadhyayula, K. S., 1999, "An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability Under Combined Temperature and Vibration Environments," Ph.D. dissertation, University of Maryland, 1999.
43. Bonda, N. R, and Noyan, I. C., 1996, IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 208-212.