Evaluation of microstructural evolution and thermal fatigue crack initiation in SN-AG-CU solder joints

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 749-756

  Sayama, Toshihiko ^a   Takayanagi, Takeshi ^b   Nagai, Yoshiaki ^b   Mori, Takao ^c   Yu, Qiang ^d  

^a TOYAMA INDUSTRIAL TECHNOLOGY CENTER   (Japan)

^b Customer Service Engineering Department   (Japan)

^c TOYAMA PREFECTURAL UNIVERSITY   (Japan)

^d YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

Lead free solder; Phase growth; Reliability; Solder joint; Thermal fatigue

Indexed keywords

CRACK INITIATION; FATIGUE OF MATERIALS; INFORMATION TECHNOLOGY; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING ALLOYS; THERMAL CYCLING; TIN ALLOYS; BIOLOGY; CRACKS; ELECTRONICS PACKAGING; FATIGUE CRACK PROPAGATION; FATIGUE DAMAGE; MICROSTRUCTURAL EVOLUTION; POLYCHLORINATED BIPHENYLS; SOLDERED JOINTS; THERMAL FATIGUE;

LEAF-FREE SOLDERS; PHASE GROWTH; THERMAL FATIGUE CRACKS; AVERAGE NUMBERS; CHIP RESISTOR; LEAD FREE SOLDERS; LEAD-FREE SOLDER JOINT; MICRO-STRUCTURAL; MICROSTRUCTURAL CHANGES; NUMBER OF CYCLES; PHASE SIZE; POWER LAW RELATION; SEM OBSERVATION; SN-3.0AG-0.5CU; SNAGCU SOLDER; SOLDER JOINTS; THERMAL CRACKS; THERMAL CYCLE TESTS;

SOLDERED JOINTS; TIN;

EID: 1242287107     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35096     Document Type: Conference Paper

References (12)

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