Assembly-level reliability of flex-substrate BGA, elastomer-onflex packages and 0.5 mm pitch partial array packages

Microelectronics Reliability

Volumn 40, Issue 7, 2000, Pages 1081-1095

  Lall, Pradeep ^a   Banerji, Kingshuk ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOMERS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY; SUBSTRATES;

FLEX SUBSTRATE BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0034228252     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00035-4     Document Type: Article

References (8)

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2. Lall P, Banerji K. Solder joint design for optimum process and reliability. Surface Mount International Conference (SMIC). San Jose, CA, Sept 9-11, 1997. p. 97-108.
3. Lall P, Gold G, Miles B, Banerji K, Thompson P, Koehler C, Adhihetty I. Reliability characterization of the SLICC package. Electronic Components and Technology Conference (ECTC). Orlando, Florida, May 28-31, 1996. p. 1202-10.
4. Lall P, Pecht M, Hakim E. Influence of temperature on microelectronic and system reliability. Boca Raton: CRC Press, 1997.
5. Banerji K, Darveaux R. Effect of aging on the strength of and ductility of controlled collapse solder joints. In: First Int Conf Micros Mech, Properties of Aging Mater. Warrendale (PA): TMS, 1993.
6. Bradley E, Lall P, Banerji K. Effect of thermal aging on the microstructure and reliability of ball grid array (BGA) solder joints. In: Proc Surf Mount Int 1996. September 8-12, 1996. p. 95-106.
7. Mahidhara R, Solberg V, DiStefano T, Greathouse S. Solder joint integrity in Tessera's μBGA package. In: Des Reliab Solders Solder Interconnections. Warrendale (PA): TMS, 1997. p. 403-12.
8. Darveaux R, Banerji K, Mawer A, Dody G. Reliability of plastic ball grid array assembly. In: John Lau, editor. Ball grid array technology. New York: McGraw Hill, 1994 [Chapter 13, p. 380-442].