Model for BGA and CSP reliability in automotive underhood applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 189-196

  Lall, Pradeep ^a   Islam, Nokibul ^a   Suhling, Jeff ^a   Darveaux, Robert ^b  

^a AUBURN UNIVERSITY   (United States)

^b AMKOR TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE ENGINEERING; CRACK PROPAGATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; TEMPERATURE;

PLASTIC BALL GRID ARRAY; THERMAL FATIGUE;

ELECTRONICS PACKAGING;

EID: 0038689365     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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