Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 90-97

  Peng, Chih Tang ^a   Kuo, Chia Tai ^a   Chiang, Kuo Ning ^a   Ku, Terry ^b   Chang, Kenny ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b VIA Technology Corporation ^*  (Taiwan)

Author keywords

Intermetallic compounds; Isothermal aging; Lead free; Sn Ag solder; Sn Pb solder; UBM

Indexed keywords

COPPER CHIPS; ELECTROPLATED SOLDER BUMPS; SILICON SUBSTRATES;

CHARACTERIZATION; ELECTROPLATING; FLIP CHIP DEVICES; INTERMETALLICS; ISOTHERMS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING ALLOYS; VEHICLES;

TIN ALLOYS;

EID: 10444275529     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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