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Volumn 24, Issue 1, 2009, Pages 271-277

High-frequency switching of SiC high-voltage LJFET

Author keywords

High frequency; JFET; Power ICs; Silicon carbide (SiC)

Indexed keywords

AUTOMOBILE DRIVERS; MONOLITHIC INTEGRATED CIRCUITS; SWITCHING;

EID: 61649087702     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2008.2005984     Document Type: Article
Times cited : (23)

References (11)
  • 1
    • 23344442558 scopus 로고    scopus 로고
    • Emerging silicon carbide power device technologies
    • A. Elford and P. Mawby, "Emerging silicon carbide power device technologies," J. Wide Bandgap Mater., vol. 7, no. 3, pp. 179-191, 2000.
    • (2000) J. Wide Bandgap Mater , vol.7 , Issue.3 , pp. 179-191
    • Elford, A.1    Mawby, P.2
  • 4
    • 0035338144 scopus 로고    scopus 로고
    • Improved high-voltage lateral RESURF MOSFETs in 4H-SiC
    • May
    • S. Banerjee, K. Chatty, T. P. Chow, and R. J. Gutmann, "Improved high-voltage lateral RESURF MOSFETs in 4H-SiC," IEEE Electron Device Lett., vol. 22, no. 5, pp. 209-211, May 2001.
    • (2001) IEEE Electron Device Lett , vol.22 , Issue.5 , pp. 209-211
    • Banerjee, S.1    Chatty, K.2    Chow, T.P.3    Gutmann, R.J.4
  • 6
    • 34247617728 scopus 로고    scopus 로고
    • 2 normally-off 4H-SiC lateral JFET, IEEE Electron Device Lett., 27, no. 10, pp. 834-836, Oct. 2006.
    • 2 normally-off 4H-SiC lateral JFET," IEEE Electron Device Lett., vol. 27, no. 10, pp. 834-836, Oct. 2006.
  • 9
    • 33947422568 scopus 로고    scopus 로고
    • Design criteria of high-voltage lateral RESURF JFETs on 4H-SiC
    • Oct
    • K. Sheng and S. Hu, "Design criteria of high-voltage lateral RESURF JFETs on 4H-SiC," IEEE Trans. Electron Devices, vol. 52, no. 10, pp. 2300-2308, Oct. 2005.
    • (2005) IEEE Trans. Electron Devices , vol.52 , Issue.10 , pp. 2300-2308
    • Sheng, K.1    Hu, S.2
  • 11
    • 34047119619 scopus 로고    scopus 로고
    • High temperature embedded SiC chip module (ECM) for power electronics applications
    • Mar
    • J. Yin, Z. Liang, and J. D. van Wyk, "High temperature embedded SiC chip module (ECM) for power electronics applications," IEEE Trans. Power Electron., vol. 22, no. 2, pp. 329-398, Mar. 2007.
    • (2007) IEEE Trans. Power Electron , vol.22 , Issue.2 , pp. 329-398
    • Yin, J.1    Liang, Z.2    van Wyk, J.D.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.