High temperature embedded SiC chip module (ECM) for power electronics applications

IEEE Transactions on Power Electronics

Volumn 22, Issue 2, 2007, Pages 392-398

  Yin, Jian ^a   Liang, Zhenxian ^a   van Wyk, Jacobus Daniel ^a  

^a State University   (United States)

Author keywords

Coefficient of thermal expansion (CTE); Embedded chip module (ECM)

Indexed keywords

HIGH TEMPERATURE EFFECTS; METALLIZING; MULTICHIP MODULES; SILICON CARBIDE; STRESS CONCENTRATION; THERMAL EXPANSION;

EMBEDDED CHIP MODULE; FLIP-OVER STRUCTURE;

POWER ELECTRONICS;

EID: 34047119619     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2006.889901     Document Type: Article

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